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The XLP208B1IFSB00160G is a microprocessor integrated circuit manufactured by Broadcom Limited. It utilizes an FCBGA+HS package with dimensions of 29x29 mm and contains 779 pins. This component is classified under the broader category of microprocessors designed for high-performance computing applications.
Verify the exact suffix and package variant against official Broadcom documentation to ensure compatibility. Confirm lead times and authenticity through authorized distributors. Cross-reference the full part number to avoid mismatches in pinout or thermal specifications.
Select this component based on specific pin count and package size requirements. Ensure the design supports the FCBGA+HS form factor. Evaluate thermal management needs for the 29x29 mm footprint. Confirm compatibility with existing system architectures before integration.
This microprocessor belongs to Broadcom's portfolio of semiconductor solutions for data center and networking markets. The XLP series typically targets high-throughput processing tasks. The specific model integrates advanced features for modern infrastructure demands.
Consult official Broadcom substitution guides for verified alternatives. Generic cross-references may not match the 779-pin layout or thermal profile. Verify electrical and mechanical compatibility before replacing.