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Product Detailed Parameters
- Description：FCBGA+HS 55X55 2870
- Series：*
- Mfr：Broadcom Limited
- Package：Bulk
- Core Processor：-
- Number of Cores/Bus Width：-
- Speed：-
- Co-Processors/DSP：-
- RAM Controllers：-
- Graphics Acceleration：-
- Display & Interface Controllers：-
- Ethernet：-
- SATA：-
- USB：-
- Voltage - I/O：-
- Operating Temperature：-
- Security Features：-
- Mounting Type：-
- Package / Case：-
- Supplier Device Package：-
- Additional Interfaces：-
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Overview
The XLP764B1IFSB00120X is a high-performance microprocessor IC from the Broadcom XLP730 series, designed for communication and networking applications. It operates within single-, dual-, and tri-band radio frequency environments to support diverse data processing tasks. The component integrates voice, video, imaging, and intelligence data capabilities into a unified architecture. It is housed in an FCBGA+HS package with dimensions of 55x55 mm and contains 2870 pins. The device is classified as a Network Controller & Processor IC under the Communication & Networking ICs subcategory.
Feature Summary
- Supports operation across single-, dual-, and tri-band radio frequencies
- Integrates processing capabilities for voice, video, imaging, and intelligence data
- Designed for high-performance network controller and processor functions
Applications
- Voice processing systems
- Video transmission equipment
- Imaging data handling units
- Intelligence data processing networks
Procurement Notes
This component is officially listed as obsolete by the manufacturer. Availability is restricted, and it may not be sold in all regions through standard distributors. Verification of current stock status and end-of-life notifications is required before procurement planning. Alternative sourcing strategies should be considered due to the discontinued status.
Selection Notes
Select this part only if legacy compatibility with the XLP730 series is mandatory. Evaluate system requirements against its specific multi-band radio frequency support and integrated multimedia processing features. Confirm that the FCBGA+HS 55x55 package fits the target board layout. Consider obsolescence implications for long-term production viability.
Part Context
The XLP764B1IFSB00120X belongs to the Broadcom XLP730 series of microprocessors. These components are engineered for demanding communication infrastructure roles. The series emphasizes high throughput for complex signal processing tasks. This specific model variant includes the IFSB suffix indicating package and thermal characteristics.
Replacement Considerations
No public confirmed substitute part numbers are available in the provided documentation. Due to the obsolete status, direct replacements must be identified through engineering evaluation of functional equivalents rather than official cross-reference lists.
