XOMAPL137BZKB3

Overview

The XOMAPL137BZKB3 is an embedded microprocessor from the Texas Instruments OMAP-L1x series. It integrates a single ARM926EJ-S core operating at 300MHz with a 32-bit bus width. The device includes a C674x DSP co-processor for signal processing and a CP15 system control processor. It features SDRAM RAM controllers and supports I/O voltages of 1.8V and 3.3V. The component is housed in a 256-BGA package, operates within a temperature range of 0°C to 90°C (TJ), and supports interfaces including Ethernet, USB 1.1/2.0, SPI, UART, I2C, MMC/SD, McASP, and HPI.

Feature Summary

• Integrates ARM926EJ-S application processor core with C674x DSP co-processor for combined computing tasks
• Supports high-speed peripheral connectivity via integrated Ethernet MAC and dual USB PHYs
• Includes dedicated SDRAM memory controller for external memory interfacing
• Provides versatile serial communication options through multiple interface standards

Applications

• Industrial automation systems requiring real-time control and signal processing
• Embedded multimedia applications utilizing DSP capabilities
• Networked devices incorporating Ethernet and USB connectivity
• Consumer electronics platforms based on ARM architecture

Procurement Notes

Verify the exact ordering suffix against the manufacturer datasheet to ensure correct package type and temperature rating. Confirm RoHS compliance status and moisture sensitivity level requirements for your assembly process. Check part status as this specific variant may be obsolete; validate availability through authorized distributors or approved substitute lists before finalizing procurement plans.

Selection Notes

Select this component when a single-chip solution combining ARM processing and DSP acceleration is required. Ensure the design accommodates the 256-BGA footprint and thermal dissipation needs for the specified operating temperature range. Verify that the available I/O voltage levels match the target system peripherals. Consider the 300MHz clock speed sufficient for the intended application workload.

Part Context

This part belongs to the Texas Instruments OMAP-L1x family, designed for applications needing both general-purpose processing and specialized digital signal processing. The series typically targets cost-sensitive embedded markets. The XOMAPL137BZKB3 specifically utilizes the BGA package variant within this lineup, distinguishing it by its physical form factor and pin count compared to other packages in the same silicon family.

Replacement Considerations

Consult official Texas Instruments documentation for direct substitutes. Cross-reference pinouts and electrical characteristics carefully if considering alternative packages within the OMAP-L137 series.