XPC823EVR75B2

Overview

The XPC823EVR75B2 is a mobile computing microprocessor from the MPC82xx family, manufactured by NXP USA Inc. It features a single-core 32-bit PowerPC G2 processor operating at 75 MHz with 99 MIPS performance. The device integrates a Communication Processor Module (CPM) for signal processing and serial communication tasks. It utilizes a 256-pin Plastic Ball Grid Array (PBGA) package measuring 23x23 mm with a 1.27 mm pitch. The component supports 3.3V I/O levels and operates within an ambient temperature range of 0°C to 95°C.

Feature Summary

• Dual-processor architecture combining a high-performance embedded PowerPC core with a specialized Communication Processor Module (CPM).
• Integrated video and LCD controllers supporting digital NTSC/PAL encoders and various TFT or passive LCD panels.
• Comprehensive connectivity including USB, Ethernet, PCMCIA-ATA, and multiple serial interfaces managed by the CPM.

Applications

• Low-power portable electronic products
• Image capture devices
• Personal communication systems

Procurement Notes

Verify the specific suffix 'EVR75B2' against official documentation to confirm pinout compatibility and thermal specifications. Confirm that the 256-lead PBGA package dimensions match the target board layout. Ensure the 0°C to 95°C operating temperature range aligns with the system's environmental requirements. Check for RoHS compliance status as indicated in the manufacturer's environmental declarations.

Selection Notes

Select this component for applications requiring a balance of general-purpose processing and dedicated peripheral handling via the CPM. The integrated video controller simplifies display interface design for portable GUI applications. Consider the static design and low-power modes if battery life is a critical constraint. Evaluate the available memory interfaces for DRAM and Flash integration needs.

Part Context

This part belongs to the MPC823 Mobile Computing Microprocessor series, originally developed by Motorola and now maintained by NXP. It represents an entry-level solution within the embedded PowerPC family, designed to offer glueless memory connections and extensive serial connectivity. The device is positioned for cost-sensitive portable markets requiring robust real-time operating system support.

Replacement Considerations

Consult the MPC823TS datasheet for direct cross-references such as XPC823ZT75B or XPC823ZC75B depending on package pitch and temperature grade. Verify functional equivalence before substitution.