XPC823EZT75BA

XPC823EZT75BA

$2.33
  • Description:IC MPU 75MHZ 256BGA
  • Series:-
  • Mfr:NXP USA Inc.
  • Package:Bulk

SKU:b6f563469a63 Category: Brand:

  
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Product Detailed Parameters

  • Description:IC MPU 75MHZ 256BGA
  • Series:-
  • Mfr:NXP USA Inc.
  • Package:Bulk
  • Core Processor:PowerPC
  • Number of Cores/Bus Width:1 Core, 32-Bit
  • Speed:75MHz
  • Co-Processors/DSP:Communications; RISC CPM
  • RAM Controllers:-
  • Graphics Acceleration:No
  • Display & Interface Controllers:LCD, Video
  • Ethernet:10Mbps (1)
  • SATA:-
  • USB:USB 1.x (1)
  • Voltage - I/O:3.3V
  • Operating Temperature:0°C ~ 95°C (TJ)
  • Security Features:-
  • Mounting Type:Surface Mount
  • Package / Case:256-BBGA
  • Supplier Device Package:256-PBGA (23x23)
  • Additional Interfaces:I2C, SMC, SCC, SPI, UART
  • Grade:-
  • Qualification:-

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XPC823EZT75BA

Overview

The XPC823EZT75BA is a PowerQUICC integrated communications processor designed for portable systems. It features a 75 MHz clock speed and utilizes a BGA256 package. The component is lead-free, RoHS compliant, and halogen-free. It operates within a specified temperature range and includes moisture sensitivity level 3 certification with a peak soldering temperature of 260°C for 40 seconds.

Feature Summary

  • Integrated communications processing capabilities optimized for portable system architectures
  • Compliance with environmental standards including lead-free, RoHS, and halogen-free specifications
  • Robust thermal and soldering characteristics suitable for surface-mount assembly processes

Applications

  • Portable communication devices requiring integrated processing
  • Embedded systems utilizing PowerQUICC architecture
  • Hardware designs adhering to strict environmental compliance standards

Procurement Notes

This component is officially designated as End of Life and is no longer manufactured by NXP USA Inc. Specifications provided are for historical reference only. Procurement should verify availability through authorized distributors or secondary markets, acknowledging that supply is limited and not guaranteed by the manufacturer. Ensure compatibility with existing design requirements before sourcing.

Selection Notes

Engineers selecting this part must account for its discontinued status. Verify that the BGA256 package and 75 MHz performance meet current design needs. Consider the long-term support implications for products requiring maintenance. Evaluate alternative components from the same family or newer generations if future production scalability is required.

Part Context

The XPC823EZT75BA belongs to the PowerQUICC series of integrated communications processors. This line was specifically engineered to handle complex communication protocols in compact form factors. The device integrates essential processing cores and interfaces, serving as a central controller for data handling in portable electronic applications during its active production lifecycle.

Replacement Considerations

No public confirmed substitute part numbers are available in the provided documentation. Users should consult NXP technical support for legacy replacement strategies or evaluate newer PowerQUICC models for functional equivalence.

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