XPC823ZT66B2T

Overview

The XPC823ZT66B2T is a mobile computing microprocessor based on the MPC823 architecture. It integrates an embedded PowerPC core with a specialized communication processor module for imaging and serial tasks. The device operates at 66 MHz within a commercial temperature range of 0°C to 95°C. It utilizes a 256-lead Plastic Ball Grid Array (PBGA) package measuring 23x23 mm with a 1.27 mm pitch. Key internal resources include 1K data cache, 2K instruction cache, and 8K dual-port RAM.

Feature Summary

• Dual-processor architecture combining a general-purpose RISC integer processor with a specialized scalar RISC communication processor module.
• Integrated video and LCD controllers supporting digital NTSC/PAL encoders and various TFT or passive display panels.
• Comprehensive serial connectivity including USB, Ethernet, HDLC, UART, USART, SPI, and I2C interfaces managed by dedicated controllers.
• Advanced power management capabilities featuring multiple operational modes such as doze, sleep, deep-sleep, and power-down.

Applications

• Low-power portable electronic products
• Image capture devices
• Personal communication systems

Procurement Notes

Verify that the specific ordering suffix matches the required package dimensions and thermal specifications. Confirm the operating temperature range aligns with system requirements. Ensure compatibility with existing development tools and software environments designed for the PowerPC architecture before finalizing procurement decisions.

Selection Notes

Select this component when a design requires integrated image processing alongside standard communication protocols without external DSPs. The dual-access memory facilitates efficient data sharing between the main core and the communication module. Evaluate the available serial channels against interface requirements to ensure sufficient connectivity for the target application.

Part Context

This part belongs to the MPC823 family of mobile computing microprocessors. It represents a cost-effective entry point into the embedded PowerPC ecosystem. The device is engineered to handle complex graphical user interfaces and real-time operating systems while maintaining low power consumption suitable for battery-operated devices.

Replacement Considerations

XPC823ZT75B provides equivalent functionality at a higher clock frequency of 75 MHz. XPC823CZT66B offers the same performance but supports an extended industrial temperature range from -40°C to 95°C. Verify pinout and register compatibility when transitioning between these variants.

FAQ

How does the communication processor module improve system efficiency?

It offloads peripheral tasks like imaging and communication from the main PowerPC core, allowing parallel execution and reducing overall power consumption.

What types of memory interfaces are supported?

The memory controller supports glueless interfaces to DRAM, SRAM, EPROM, Flash EPROM, SDRAM, and EDO memory across eight configurable banks.