XPC8240RZU250E

XPC8240RZU250E

  • Description:IC MPU MPC82XX 250MHZ 352TBGA
  • Series:MPC82xx
  • Mfr:NXP USA Inc.
  • Package:Tray

SKU:74ca4da7f5e6 Category: Brand:

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Product Detailed Parameters

  • Description:IC MPU MPC82XX 250MHZ 352TBGA
  • Series:MPC82xx
  • Mfr:NXP USA Inc.
  • Package:Tray
  • Core Processor:PowerPC 603e
  • Number of Cores/Bus Width:1 Core, 32-Bit
  • Speed:250MHz
  • Co-Processors/DSP:-
  • RAM Controllers:DRAM, SDRAM
  • Graphics Acceleration:No
  • Display & Interface Controllers:-
  • Ethernet:-
  • SATA:-
  • USB:-
  • Voltage - I/O:3.3V
  • Operating Temperature:0°C ~ 105°C (TA)
  • Security Features:-
  • Mounting Type:Surface Mount
  • Package / Case:352-LBGA
  • Supplier Device Package:352-TBGA (35x35)
  • Additional Interfaces:I2C, I²O, PCI, UART
  • Grade:-
  • Qualification:-

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XPC8240RZU250E

Overview

The XPC8240RZU250E is a pilot production prototype integrated processor based on the MPC603e core, operating at a maximum frequency of 250 MHz. It utilizes a TBGA-352 package and requires a core supply voltage of 2.625 V ±125 mV. The device supports an operating temperature range from 0°C to 105°C. Key specifications include a 32-bit data bus width, 16 kB L1 instruction cache, and 16 kB L1 data cache. Power consumption varies by mode, with typical active power reaching up to 3.8 W.

Feature Summary

  • Features a high-performance, superscalar MPC603e processor core with floating-point support.
  • Integrates a 32-bit PCI interface supporting operation up to 66 MHz.
  • Includes dual-channel DMA controllers capable of cascading for enhanced throughput.
  • Supports dynamic power management with Doze, Nap, and Sleep modes.

Applications

  • Network infrastructure control processing
  • Telecommunications embedded systems
  • Router and switch control units
  • Network storage applications

Procurement Notes

Verify that the component is accepted as a Pilot Production Prototype, which carries preliminary reliability data and may undergo product changes. Ensure written authorization acknowledging qualification status is on file before shipment. Confirm the specific die mask revision via the Revision ID register, as this part supersedes previous hardware specifications regarding voltage and electrical characteristics.

Selection Notes

Select this component when a cost-effective, highly integrated solution is required for embedded systems utilizing PCI interfaces. The design reduces system component count compared to discrete chip solutions. Verify compatibility with Power Architecture software environments. Consider the modified voltage specifications necessary to achieve the 250 MHz operating frequency when designing power delivery networks.

Part Context

This part belongs to the MPC8240 series of integrated communications processors designed for portable and embedded systems. It replaces multiple discrete chips with a single unit to lower costs and simplify board design. The 'X' prefix indicates it is a limited volume prototype manufactured on qualified technology for simulation purposes.

Replacement Considerations

Public confirmed substitute part numbers are not available in the provided documentation.

FAQ

What does the 'X' prefix indicate in the part number?

The 'X' prefix designates the component as a Pilot Production Prototype, meaning it has only preliminary reliability and characterization data and may experience product changes.

How is the die mask revision determined?

The revision level can be determined by reading the Revision ID register located at address offset 0x08.

Does this document supersede previous specifications?

Yes, this document supersedes the MPC8240 Integrated Processor Hardware Specifications, Revision 1.0 or later, specifically for the listed part numbers.

XPC8240RZU250EXPC8240RZU250E

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