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The XPC8255VVIFBC is a PowerPC G2 microprocessor belonging to the MPC82xx series, manufactured by NXP USA Inc. It features a single 32-bit core operating at a speed of 200MHz. The device is housed in a 480-LBGA package with an exposed pad, specifically identified as a 480-TBGA (37.5x37.5) supplier device package. It supports I/O voltages of 3.3V and operates within a temperature range of 0°C to 105°C (TA). Key integrated controllers include DRAM and SDRAM interfaces. Additional communication interfaces supported are I2C, SCC, SMC, SPI, UART, and USART. The processor utilizes a Communications Processor Module (CPM) for communications and RISC tasks.
Verify component authenticity through authorized distributors or direct manufacturer channels. Confirm RoHS3 compliance status and REACH unaffected classification prior to integration. Check for obsolete part status implications on long-term supply availability. Ensure EOL management strategies are in place given the product lifecycle stage.
Select this component when a PowerPC G2 architecture is required for embedded applications. Consider the 480-TBGA package constraints for PCB layout and thermal design. Evaluate the 200MHz clock speed against application performance needs. Verify compatibility with existing DRAM/SDRAM memory solutions and interface requirements.
This microprocessor is part of the broader MPC82xx family, which includes variants like the MPC8260 and MPC8265. These devices are designed for high-performance embedded control and communications tasks. The XPC8255VVIFBC shares architectural similarities with other members of the PowerQUICC II family, offering scalable processing capabilities for industrial and commercial applications.
Consult official documentation for cross-references within the MPC82xx family. No specific substitute part numbers are confirmed in public data. Evaluate functional equivalence regarding core architecture, pinout, and electrical characteristics before considering alternatives.