SEARCH
— IC芯片 | 连接器 | 传感器 | 被动器件 —
The XPC8255ZUIFBC is a microprocessor IC from the MPC82xx series, manufactured by NXP USA Inc. It features a PowerPC G2 core with a single 32-bit architecture operating at a speed of 200MHz. The device is housed in a 480-LBGA exposed pad package, specifically identified as a 480-TBGA (37.5x37.5) supplier device package. It includes RAM controllers for DRAM and SDRAM, and supports additional interfaces such as I2C, SCC, SMC, SPI, UART, and USART. The component operates within a temperature range of -40°C to 105°C (TA) and utilizes 3.3V I/O voltage.
Verify the exact suffix configuration against official datasheets, as variations may exist within the MPC82xx family. Confirm that the 480-TBGA package dimensions match the target PCB footprint. Ensure compatibility with the required operating temperature range and voltage levels before integration into the final design.
Select this component when a 200MHz PowerPC G2 core is required with integrated memory controllers. Consider the 480-pin BGA package constraints during layout. Verify support for necessary peripheral interfaces like Ethernet or serial ports if not provided by external components.
This part belongs to the MPC82xx series of microprocessors designed for high-performance embedded applications. It is related to other variants in the PowerQUICC II family, sharing architectural similarities but differing in clock speeds, packages, and interface configurations.
Public confirmed substitute part numbers are not available in the provided documentation. Consult manufacturer resources for cross-references within the MPC82xx family.