SEARCH
— IC芯片 | 连接器 | 传感器 | 被动器件 —
The XPC8260CVVIFBC is a PowerQUICC II integrated communications processor based on the PowerPC G2 core architecture. It features a single 32-bit core operating at 266 MHz and includes a Communications Processor Module (CPM). The device integrates Ethernet MACs, USB 2.0 controllers, and memory controllers for SDRAM and DRAM. It is housed in a 480-TBGA package measuring 37.5x37.5 mm and supports an operating temperature range of -40°C to 105°C.
Verify the manufacturer origin carefully, as the 'X' prefix often denotes cross-manufacturer or legacy design transfers distinct from standard NXP MPC82xx production. Confirm RoHS compliance status and lead times directly with authorized distributors, as this component may be classified as obsolete or end-of-life. Ensure the specific suffix matches your board design requirements.
Select this component when a robust PowerPC solution with hardware-accelerated serial communication is required. The CPM handles complex protocols like HDLC and PPP, reducing CPU load. Consider the TBGA package size and thermal dissipation capabilities during PCB layout. Verify compatibility with existing memory subsystems and peripheral interfaces before finalizing the design.
This part belongs to the MPC82xx family of PowerQUICC processors designed for embedded networking applications. These devices are characterized by their integration of network peripherals and a powerful RISC core, targeting high-performance communication gateways and routers in industrial and telecom sectors.
Consult official documentation for confirmed substitute part numbers within the MPC82xx series. Cross-reference pinouts and electrical characteristics with newer generations if available.