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The XPC8260CVVIFBC is a PowerPC G2 microprocessor from the MPC82xx series, manufactured by NXP USA Inc. It features a single 32-bit core operating at a clock speed of 200MHz. The component is housed in a 480-LBGA package with an exposed pad, measuring 37.5x37.5 mm. It operates at a voltage of 1.8V and supports surface mount mounting. This integrated circuit is designed for embedded applications requiring communications processing capabilities.
Verify the exact package dimensions and pinout against the official NXP datasheet before integration. Confirm that the 480-LBGA footprint matches your PCB design constraints. Ensure thermal management solutions are adequate for the 200MHz operation profile. Check for RoHS compliance documentation if required by your manufacturing standards. Validate supply chain authenticity through authorized distributors.
Select this component when a dedicated PowerPC G2 core is required for legacy or specific embedded architectures. Consider the 480-LBGA package size for board space limitations. Evaluate the 200MHz performance against application throughput requirements. Compare peripheral integration levels with other MPC82xx variants like the MPC8264 or MPC8265 if additional features are needed.
This part belongs to the NXP MPC82xx family, specifically the PowerQUICC II series. These processors are designed for communications applications, integrating host processors with PCI, USB, and CPM peripherals. The XPC8260 variant offers a balance of processing power and integrated I/O for networking and industrial uses.
Check for direct substitutes within the MPC82xx family such as the MPC8260ACZUMHBB. Verify compatibility with existing software drivers and hardware interfaces. Ensure pin-to-pin compatibility if replacing on an existing board layout.