ChipApex | Global Electronic Components Supplier
SEARCH
Search Product
Search Post
— IC芯片 | 连接器 | 传感器 | 被动器件 —
Consult the customer manager about the wholesale price.
consultation hotline：86-132-6715-2157
email：[email protected]
Contact the product manager for consultation. One-stop consultation is available.
Do you want a lower wholesale price? Please send us your inquiry and we will reply immediately.
Product Detailed Parameters
- Description：IC MPU MPC82XX 200MHZ 480TBGA
- Series：MPC82xx
- Mfr：NXP USA Inc.
- Package：Tray
- Core Processor：PowerPC G2
- Number of Cores/Bus Width：1 Core, 32-Bit
- Speed：200MHz
- Co-Processors/DSP：Communications; RISC CPM
- RAM Controllers：DRAM, SDRAM
- Graphics Acceleration：No
- Display & Interface Controllers：-
- Ethernet：10/100Mbps (3)
- SATA：-
- USB：-
- Voltage - I/O：3.3V
- Operating Temperature：-40°C ~ 105°C (TA)
- Security Features：-
- Mounting Type：Surface Mount
- Package / Case：480-LBGA Exposed Pad
- Supplier Device Package：480-TBGA (37.5x37.5)
- Additional Interfaces：I2C, SCC, SMC, SPI, UART, USART
- Grade：-
- Qualification：-
Download product information
Overview
The XPC8260CVVIHBC is a PowerPC G2 microprocessor from the MPC82xx family, manufactured by NXP USA Inc. It features a single 32-bit core operating at a clock speed of 200 MHz. The device is housed in a 480-ball Thin Ball Grid Array (TBGA) package with dimensions of 37.5x37.5 mm and includes an exposed pad for thermal management. It supports an operating temperature range of -40°C to 105°C (TA). This component belongs to the PowerQUICC II series, designed for integrated communications processing applications.
Feature Summary
- Integrates a high-performance PowerPC G2 core optimized for embedded communications tasks
- Supports advanced communication protocols including PCI, USB, and HDLC within the PowerQUICC II architecture
- Features a robust 480-ball TBGA package suitable for dense board layouts and thermal dissipation
Applications
- Integrated host processors requiring PCI and USB connectivity
- Communications processor modules utilizing UTOPIA interfaces
- Network infrastructure equipment demanding high-speed data processing
Procurement Notes
Verify the specific suffix codes against official NXP documentation to confirm pinout compatibility and electrical characteristics. Confirm that the 480-TBGA package dimensions match your PCB footprint requirements. Ensure that the operating temperature range meets your system's environmental specifications. Check for obsolete status or lifecycle notices before finalizing procurement plans.
Selection Notes
Select this component when a dedicated PowerPC G2 core is required for complex protocol handling. Consider the 480-ball package size for mechanical constraints. Evaluate the 200 MHz performance against application latency needs. Compare power consumption metrics with alternative MPC82xx variants if thermal limits are critical. Verify peripheral availability such as Ethernet controllers or HDLC channels.
Part Context
This part belongs to the MPC82xx family, specifically the PowerQUICC II series. These processors integrate PCI, USB, and communications processor modules. They are designed for high-performance embedded networking and telecommunications systems. The family shares common architectural features but varies in peripheral integration and package options.
Replacement Considerations
Consult official substitution guides for compatible MPC82xx variants. Verify pin-to-pin compatibility for direct replacements. Ensure functional equivalence in peripheral support and clock speeds.
