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The XPC8260VVIFBC is a PowerQUICC II integrated communications processor based on the PowerPC G2 core. It features a single 32-bit core operating at 200MHz within the MPC82xx family. The device utilizes a 480-TBGA package with dimensions of 37.5x37.5 mm and supports surface mount mounting. It includes DRAM and SDRAM controllers, along with interfaces such as I2C, SCC, SMC, SPI, UART, and USART. The component operates at 3.3V I/O voltage and functions within an ambient temperature range of 0°C to 105°C.
Verify the specific suffix 'VVIFBC' against official NXP documentation to confirm pinout and electrical characteristics. Confirm RoHS compliance status and moisture sensitivity level prior to assembly. Ensure the obsolete part status is accounted for in long-term supply chain planning. Validate that the 480-TBGA footprint matches the target PCB design constraints.
Select this component when a dedicated PowerQUICC II architecture is required for network infrastructure applications. Consider the 200MHz clock speed and integrated CPM for handling complex protocol stacks. Evaluate the 480-pin BGA package size against available board real estate. Compare against newer HiP4 derivatives if higher performance or lower power consumption is necessary.
This microprocessor belongs to the Freescale MPC82xx series, specifically the PowerQUICC II family designed for communications networking. It represents a generation of processors utilizing the PowerPC G2 core architecture. The device was manufactured by Freescale Semiconductor, which has since been acquired by NXP USA Inc. The part is categorized under embedded microprocessors for specialized data plane processing.
Public confirmed substitute part numbers are not available in the provided documentation. The component is listed with an obsolete part status. Engineering changes may require migration to newer MPC82xxA series devices, but specific cross-references must be verified through official manufacturer transition guides.