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The XPC850CZT50BU is a PowerQUICC integrated communications processor based on the PowerPC architecture. It features a single 32-bit core operating at a maximum clock frequency of 50 MHz. The device includes 2 KB of L1 instruction cache and 1 KB of L1 data cache. It operates at a supply voltage of 3.3 V and is housed in a 256-pin PBGA package measuring 23x23 mm. The component supports surface mount installation and functions within an ambient temperature range of -40°C to 95°C.
Verify component authenticity through authorized NXP distributors or certified suppliers. Confirm the specific suffix 'ZT' matches the required package and temperature grade. Check for obsolescence status as this model may be discontinued. Ensure compatibility with existing PCB footprints for the 256-BGA package. Request original manufacturer documentation to validate technical specifications before integration.
Select this component when a single-chip solution combining a PowerPC processor with a CPM is required. Consider the 50 MHz performance limit and 3.3 V power requirements against system needs. Evaluate the 256-BGA package constraints for board layout. Compare against newer MPC85xx series variants if higher performance or updated interfaces are necessary. Verify thermal dissipation capabilities for the specified operating temperature range.
This part belongs to the MPC850 family of PowerQUICC processors, designed for embedded communications and control tasks. It integrates the PowerPC CPU core with the Communications Processor Module to handle serial protocol processing. The family targets applications needing efficient data handling and low power consumption in compact packages.
Public confirmed substitute part numbers are not available in the provided source material.