XPC850CZT50BU

XPC850CZT50BU

$24.60
  • Description:IC MPU MPC8XX 50MHZ 256BGA
  • Series:MPC8xx
  • Mfr:NXP USA Inc.
  • Package:Tray

SKU:c600844e0510 Category: Brand:

  
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Product Detailed Parameters

  • Description:IC MPU MPC8XX 50MHZ 256BGA
  • Series:MPC8xx
  • Mfr:NXP USA Inc.
  • Package:Tray
  • Core Processor:MPC8xx
  • Number of Cores/Bus Width:1 Core, 32-Bit
  • Speed:50MHz
  • Co-Processors/DSP:Communications; CPM
  • RAM Controllers:DRAM
  • Graphics Acceleration:No
  • Display & Interface Controllers:-
  • Ethernet:10Mbps (1)
  • SATA:-
  • USB:USB 1.x (1)
  • Voltage - I/O:3.3V
  • Operating Temperature:-40°C ~ 95°C (TA)
  • Security Features:-
  • Mounting Type:Surface Mount
  • Package / Case:256-BGA
  • Supplier Device Package:256-PBGA (23x23)
  • Additional Interfaces:HDLC/SDLC, I2C, IrDA, PCMCIA-ATA, TDM, UART/USART

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XPC850CZT50BU

Overview

The XPC850CZT50BU is a PowerQUICC integrated communications processor based on the PowerPC architecture. It features a single 32-bit core operating at a maximum clock frequency of 50 MHz. The device includes 2 KB of L1 instruction cache and 1 KB of L1 data cache. It operates at a supply voltage of 3.3 V and is housed in a 256-pin PBGA package measuring 23x23 mm. The component supports surface mount installation and functions within an ambient temperature range of -40°C to 95°C.

Feature Summary

  • Integrates a PowerPC core with Communications Processor Module (CPM) for versatile controller applications
  • Provides on-chip memory resources including dedicated L1 instruction and data caches
  • Supports high-temperature operation suitable for industrial environments

Applications

  • Integrated controller applications requiring combined processing and peripheral management
  • Communications systems utilizing PowerQUICC architecture
  • Industrial control units operating in extended temperature ranges

Procurement Notes

Verify component authenticity through authorized NXP distributors or certified suppliers. Confirm the specific suffix 'ZT' matches the required package and temperature grade. Check for obsolescence status as this model may be discontinued. Ensure compatibility with existing PCB footprints for the 256-BGA package. Request original manufacturer documentation to validate technical specifications before integration.

Selection Notes

Select this component when a single-chip solution combining a PowerPC processor with a CPM is required. Consider the 50 MHz performance limit and 3.3 V power requirements against system needs. Evaluate the 256-BGA package constraints for board layout. Compare against newer MPC85xx series variants if higher performance or updated interfaces are necessary. Verify thermal dissipation capabilities for the specified operating temperature range.

Part Context

This part belongs to the MPC850 family of PowerQUICC processors, designed for embedded communications and control tasks. It integrates the PowerPC CPU core with the Communications Processor Module to handle serial protocol processing. The family targets applications needing efficient data handling and low power consumption in compact packages.

Replacement Considerations

Public confirmed substitute part numbers are not available in the provided source material.

XPC850CZT50BUXPC850CZT50BU
$24.60
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