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The XPC850DECVR50BU is a microprocessor IC from the MPC8xx series, manufactured by NXP USA Inc. It features a single 32-bit PowerPC core operating at a maximum clock frequency of 50MHz. The device integrates a Communications Processor Module (CPM) for handling serial communications tasks. It utilizes a 256-pin Plastic Ball Grid Array (PBGA) package with dimensions of 23x23 mm. The component supports an I/O voltage of 3.3V and operates within a temperature range of 0°C to 95°C. Key interfaces include Ethernet, USB 1.x, HDLC/SDLC, I2C, IrDA, PCMCIA-ATA, TDM, and UART/USART.
Verify component authenticity through authorized distributors as this part is obsolete. Confirm RoHS compliance status and check for equivalent replacement options due to end-of-life status. Ensure compatibility with existing PCB footprints and thermal requirements before procurement planning.
Select this component only if legacy MPC8xx architecture compatibility is required. Evaluate the 50MHz performance limit against current application needs. Consider the availability of development tools and documentation support for the PowerPC core and CPM module during system design.
This microprocessor belongs to the MPC8xx family, which was widely used in networking and industrial applications. The XPC prefix typically denotes a specific commercial or extended temperature variant within the broader MPC850 product line, sharing core architectural features with other members of the series.
Public confirmed substitute part numbers: KMPC850DSLVR50BU, MPC850CZQ50BU. Verify pinout and electrical specifications match before substitution.
The Communications Processor Module (CPM) handles serial communication protocols such as HDLC, SDLC, and Ethernet MAC functions, offloading these tasks from the main PowerPC core.
Yes, the XPC850DECVR50BU is RoHS3 compliant according to manufacturer data sheets.