XPC850DECZT50BU

XPC850DECZT50BU

$27.68
  • Description:IC MPU MPC8XX 50MHZ 256BGA
  • Series:MPC8xx
  • Mfr:NXP USA Inc.
  • Package:Tray

SKU:9edc92e436e5 Category: Brand:

  
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Product Detailed Parameters

  • Description:IC MPU MPC8XX 50MHZ 256BGA
  • Series:MPC8xx
  • Mfr:NXP USA Inc.
  • Package:Tray
  • Core Processor:MPC8xx
  • Number of Cores/Bus Width:1 Core, 32-Bit
  • Speed:50MHz
  • Co-Processors/DSP:Communications; CPM
  • RAM Controllers:DRAM
  • Graphics Acceleration:No
  • Display & Interface Controllers:-
  • Ethernet:10Mbps (1)
  • SATA:-
  • USB:USB 1.x (1)
  • Voltage - I/O:3.3V
  • Operating Temperature:-40°C ~ 95°C (TA)
  • Security Features:-
  • Mounting Type:Surface Mount
  • Package / Case:256-BGA
  • Supplier Device Package:256-PBGA (23x23)
  • Additional Interfaces:HDLC/SDLC, I2C, IrDA, PCMCIA-ATA, TDM, UART/USART

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XPC850DECZT50BU

Overview

The XPC850DECZT50BU is a microprocessor from the MPC8xx family, manufactured by NXP USA Inc. It features a single PowerPC core with a 32-bit data bus width and operates at a maximum clock frequency of 50 MHz. The device includes 2 KB of L1 instruction cache and 1 KB of L1 data cache. It functions within an operating temperature range of -40°C to 95°C (TA) and requires a 3.3 V supply voltage. The component is housed in a 256-pin PBGA package measuring 23x23 mm and supports surface mount installation.

Feature Summary

  • Integrates a single-core PowerPC architecture for embedded processing tasks
  • Includes dedicated L1 instruction and data caches for memory management
  • Supports surface mount technology in a compact 256-pin BGA package

Applications

  • Embedded control systems requiring PowerPC architecture
  • Industrial automation controllers
  • Telecommunications infrastructure equipment

Procurement Notes

Verify the exact suffix codes against official NXP documentation to confirm pinout and electrical specifications. Confirm availability status as distribution channels vary. Ensure compatibility with existing board designs regarding the 256-BGA footprint and 3.3V power requirements before procurement.

Selection Notes

Select this component when a PowerPC-based solution with integrated caches is required for industrial or telecom applications. Consider the 256-pin BGA package constraints and thermal performance within the specified -40°C to 95°C range. Verify that the 50 MHz operational speed meets system timing requirements.

Part Context

This part belongs to the MPC8xx series of microprocessors designed for high-performance embedded applications. The series typically integrates communications processor modules (CPM) alongside the PowerPC core. This specific variant utilizes the DECZT suffix indicating package and temperature characteristics within the broader MPC850 product line.

Replacement Considerations

Consult official NXP substitution guides for compatible alternatives. Cross-reference pinouts and electrical parameters carefully when considering equivalent parts from other manufacturers.

XPC850DECZT50BUXPC850DECZT50BU
$27.68
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