XPC850DSLCZT50BU

XPC850DSLCZT50BU

$19.47
  • Description:IC MPU MPC8XX 50MHZ 256BGA
  • Series:MPC8xx
  • Mfr:NXP USA Inc.
  • Package:Tray

SKU:3b0314a0ebaa Category: Brand:

  
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Product Detailed Parameters

  • Description:IC MPU MPC8XX 50MHZ 256BGA
  • Series:MPC8xx
  • Mfr:NXP USA Inc.
  • Package:Tray
  • Core Processor:MPC8xx
  • Number of Cores/Bus Width:1 Core, 32-Bit
  • Speed:50MHz
  • Co-Processors/DSP:Communications; CPM
  • RAM Controllers:DRAM
  • Graphics Acceleration:No
  • Display & Interface Controllers:-
  • Ethernet:10Mbps (1)
  • SATA:-
  • USB:USB 1.x (1)
  • Voltage - I/O:3.3V
  • Operating Temperature:-40°C ~ 95°C (TA)
  • Security Features:-
  • Mounting Type:Surface Mount
  • Package / Case:256-BGA
  • Supplier Device Package:256-PBGA (23x23)
  • Additional Interfaces:HDLC/SDLC, I2C, IrDA, PCMCIA-ATA, TDM, UART/USART

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XPC850DSLCZT50BU

Overview

The XPC850DSLCZT50BU is a microprocessor IC from the MPC8xx series, manufactured by NXP USA Inc. It features a single 32-bit core operating at a speed of 50MHz. The device is housed in a 256-PBGA package with dimensions of 23x23 mm and supports surface mount mounting. It operates within an ambient temperature range of 0°C to 95°C and utilizes 3.3V I/O voltage levels. The processor integrates a Communications Processor Module (CPM) and DRAM controllers.

Feature Summary

  • Integrates a Communications Processor Module for handling serial communication protocols
  • Supports multiple interface standards including HDLC/SDLC, I2C, IrDA, PCMCIA-ATA, TDM, and UART/USART
  • Includes dedicated DRAM controllers for memory management
  • Provides Ethernet connectivity at 10Mbps speeds

Applications

  • Controller applications requiring integrated communications processing
  • Network infrastructure equipment utilizing Ethernet and serial interfaces
  • Industrial control systems operating within specified temperature ranges

Procurement Notes

Verify component authenticity through authorized NXP distributors or certified suppliers. Confirm RoHS compliance status as indicated in official documentation, noting potential non-compliance for specific variants. Ensure the 256-BGA package matches PCB footprint requirements. Validate operating temperature specifications against environmental conditions. Check part status for obsolescence before finalizing procurement plans.

Selection Notes

Select this component when a 32-bit RISC processor with integrated CPM functionality is required. Consider the 50MHz clock speed and 256-pin BGA package constraints. Evaluate compatibility with 3.3V logic levels and DRAM interface requirements. Assess suitability for applications needing built-in support for HDLC, SDLC, and Ethernet protocols without external controller chips.

Part Context

This part belongs to the MPC8xx PowerQUICC family, designed for embedded networking and communications. It combines a PowerPC-compatible core with peripheral integration to reduce system complexity. The MPC850 variant specifically targets cost-sensitive applications requiring moderate performance and extensive serial interface support.

Replacement Considerations

Consult official NXP documentation for verified cross-references. No direct substitute part numbers are confirmed in the provided source material.

XPC850DSLCZT50BUXPC850DSLCZT50BU
$19.47
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