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The XPC850DSLCZT50BU is a microprocessor IC from the MPC8xx series, manufactured by NXP USA Inc. It features a single 32-bit core operating at a speed of 50MHz. The device is housed in a 256-PBGA package with dimensions of 23x23 mm and supports surface mount mounting. It operates within an ambient temperature range of 0°C to 95°C and utilizes 3.3V I/O voltage levels. The processor integrates a Communications Processor Module (CPM) and DRAM controllers.
Verify component authenticity through authorized NXP distributors or certified suppliers. Confirm RoHS compliance status as indicated in official documentation, noting potential non-compliance for specific variants. Ensure the 256-BGA package matches PCB footprint requirements. Validate operating temperature specifications against environmental conditions. Check part status for obsolescence before finalizing procurement plans.
Select this component when a 32-bit RISC processor with integrated CPM functionality is required. Consider the 50MHz clock speed and 256-pin BGA package constraints. Evaluate compatibility with 3.3V logic levels and DRAM interface requirements. Assess suitability for applications needing built-in support for HDLC, SDLC, and Ethernet protocols without external controller chips.
This part belongs to the MPC8xx PowerQUICC family, designed for embedded networking and communications. It combines a PowerPC-compatible core with peripheral integration to reduce system complexity. The MPC850 variant specifically targets cost-sensitive applications requiring moderate performance and extensive serial interface support.
Consult official NXP documentation for verified cross-references. No direct substitute part numbers are confirmed in the provided source material.