SEARCH
— IC芯片 | 连接器 | 传感器 | 被动器件 —
The XPC850DSLZT50BU is an embedded microprocessor from the MPC8xx series, manufactured by NXP USA Inc. It features a single-core 32-bit architecture with a maximum clock speed of 50MHz. The device utilizes a 256-pin PBGA package (23x23 mm) and operates at a 3.3V I/O voltage. It supports an operating temperature range of 0°C to 95°C (TA). Key integrated peripherals include a Communications Processor Module (CPM), DRAM controller, Ethernet MAC supporting 10Mbps, USB 1.x, HDLC/SDLC, I2C, IrDA, PCMCIA-ATA, TDM, and UART/USART interfaces.
Verify component authenticity through authorized NXP distributors or certified suppliers. Confirm RoHS compliance status as listed data indicates non-compliance. Check manufacturing date codes against project timelines due to obsolete part status. Ensure ESD protection measures are implemented during handling. Validate pin compatibility with existing PCB footprints before procurement.
Select this component for legacy MPC8xx-based designs requiring specific CPM functionality. Consider power consumption and thermal dissipation within the 0°C to 95°C operational range. Evaluate interface availability against system requirements, noting the absence of graphics acceleration. Verify software support availability for the 32-bit PowerPC core architecture.
This part belongs to the MPC8xx family of PowerQUICC processors, designed for embedded control and communications tasks. It represents an earlier generation of NXP's integrated microprocessors, preceding the more advanced PowerQUICC III series. The MPC8xx line was widely used in telecommunications and industrial control markets before being superseded by newer architectures.
No direct public substitute part numbers are confirmed for this obsolete component. Designers may need to evaluate newer NXP PowerQUICC III processors such as the MPC8543E or MPC8548E for upgraded performance, though architectural differences require significant redesign.