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The XPC860ENCZP50D3 is a 32-bit RISC microprocessor manufactured by Motorola (NXP). It operates at a maximum clock frequency of 50 MHz and utilizes CMOS technology. The device is housed in a PBGA357 plastic BGA package with 357 terminals. It features a 32-bit address bus and a 32-bit external data bus. The nominal supply voltage is 3.3 V, with a maximum of 3.465 V and a minimum of 3.135 V. The component is surface mountable and has a square grid array form factor.
Verify the specific suffix codes against official NXP documentation to confirm pinout compatibility and electrical specifications. Ensure the procurement source provides valid traceability for this legacy component. Cross-reference the manufacturer designation between Motorola and NXP entities to ensure authenticity. Confirm the package type matches the required PCB footprint before ordering.
Select this processor when a 50 MHz 32-bit RISC core is required within a BGA-357 footprint. Consider the 3.3 V operating voltage constraints during power supply design. Evaluate the thermal dissipation requirements associated with the plastic BGA package. Verify that the system memory interface aligns with the 32-bit external data bus width.
This component belongs to the XPC860 family of embedded processors. It is designed for high-performance real-time control applications. The device integrates the core processing capabilities necessary for complex embedded environments. It serves as a central processing unit for specialized hardware platforms.
Publicly confirmed substitute part numbers are not available in the provided documentation. Verify compatibility with existing system designs before considering alternative components.