XRT75R12DIB-L

XRT75R12DIB-L

  • Description:IC TELECOM INTERFACE 420TBGA
  • Series:-

SKU:24356fa43e30 Category: Brand:

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Product Detailed Parameters

  • Description:IC TELECOM INTERFACE 420TBGA
  • Series:-
  • Mfr:MaxLinear, Inc.
  • Package:Tray
  • Function:Line Interface Unit (LIU)
  • Interface:LIU
  • Number of Circuits:12
  • Voltage - Supply:3.135V ~ 3.465V
  • Current - Supply:-
  • Operating Temperature:-40°C ~ 85°C
  • Mounting Type:Surface Mount
  • Package / Case:420-LBGA
  • Supplier Device Package:420-TBGA (35x35)
  • Power (Watts):-
  • Grade:-
  • Qualification:-

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XRT75R12DIB-L

Overview

The XRT75R12DIB-L is a twelve-channel Line Interface Unit (LIU) manufactured by MaxLinear, designed for E3, DS3, and STS-1 SONET applications. It integrates jitter reduction capabilities within a single package to support high-speed telecommunications interfaces. The device operates with a supply voltage range of 3.3V to 5V and supports an industrial temperature range from -45°C to +85°C. It is housed in a 420-ball Thin Ball Grid Array (TBGA) package measuring 35x35 mm. This component serves as a critical interface for synchronizing data streams in digital transmission systems.

Feature Summary

  • Integrates twelve independent channels for simultaneous E3, DS3, or STS-1 line interfacing
  • Includes built-in jitter reduction circuitry to enhance signal integrity
  • Supports flexible power supply requirements between 3.3V and 5V
  • Rated for extended industrial operating temperatures

Applications

  • SONET/SDH network synchronization equipment
  • Digital cross-connect systems (DCS)
  • Multiplexer systems requiring E3/DS3/STS-1 interfaces
  • Telecommunications infrastructure timing units

Procurement Notes

This component is officially listed as End-of-Life (EOL) by the manufacturer. Availability is restricted, and distributors may not stock new units. Verification of authenticity and condition is critical when sourcing from secondary markets. Engineers should initiate replacement design cycles immediately due to discontinuation status.

Selection Notes

Designers must account for the 420-ball TBGA package complexity during PCB layout and assembly. The device requires careful thermal management within the specified -45°C to +85°C range. Verify that the target system supports both 3.3V and 5V logic levels if migrating from previous generations. Ensure sufficient board space for the 35x35 mm footprint.

Part Context

The XRT75R12DIB-L belongs to the XRT75 series of telecom interface ICs originally developed by Exar Corporation and later acquired by MaxLinear. It is part of a family of LIUs that provide multi-channel connectivity for standard digital hierarchy signals. The 'IB' suffix typically denotes the specific package and feature set, while 'L' indicates lead-free compliance.

Replacement Considerations

Publicly confirmed substitute part numbers are not available in the provided documentation. Due to the End-of-Life status, direct pin-to-pin replacements may require schematic review. Consider consulting MaxLinear for current portfolio alternatives or evaluating generic multi-channel LIU solutions.

XRT75R12DIB-LXRT75R12DIB-L

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