Microcontrollers XS1-A10A-128-FB217-C10 product image

XS1-A10A-128-FB217-C10

  • Description:IC MCU 32BIT 128KB SRAM 217FBGA
  • Series:XS1
  • Mfr:XMOS
  • Package:Tray
  • Core Processor:XCore

SKU:20f63f1a2c61 Category: Brand:

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XS1-A10A-128-FB217-C10 is listed in the Microcontrollers range at ChipApex. The manufacturer field lists XMOS. Its product description is IC MCU 32BIT 128KB SRAM 217FBGA. Review the specifications below when checking this part for your BOM.

Microcontrollers specifications for XS1-A10A-128-FB217-C10

  • Description:IC MCU 32BIT 128KB SRAM 217FBGA
  • Series:XS1
  • Mfr:XMOS
  • Package:Tray
  • Core Processor:XCore
  • Core Size:32-Bit 10-Core
  • Speed:1000MIPS
  • Connectivity:Configurable
  • Peripherals:-
  • Number of I/O:90
  • Program Memory Size:128KB (32K x 32)
  • Program Memory Type:SRAM
  • EEPROM Size:-
  • RAM Size:-
  • Voltage - Supply (Vcc/Vdd):0.90V ~ 5.5V
  • Data Converters:A/D 8x12b
  • Oscillator Type:Internal
  • Operating Temperature:0°C ~ 70°C (TA)
  • Mounting Type:Surface Mount
  • Supplier Device Package:217-FBGA (16x16)
  • Package / Case:217-LFBGA
  • Grade:-
  • Qualification:-

Microcontrollers datasheet and documents for XS1-A10A-128-FB217-C10

XS1-A10A-128-FB217-C10

Microcontrollers Overview

The XS1-A10A-128-FB217-C10 is a 32-bit microcontroller from the XMOS XCore family. It features an 8-core architecture with a processing speed of 1000 MIPS. The device includes 128 KB of SRAM (organized as 32K x 32 bits) and is ROMless. It is housed in a 217-pin FBGA package measuring 16x16 mm. The component operates within the commercial temperature range, indicated by the C10 suffix.

Microcontrollers Feature Summary

  • Eight parallel processing cores for deterministic real-time execution
  • Integrated 128 KB SRAM for data storage without external memory requirements
  • High-performance 1000 MIPS throughput for complex audio and control tasks
  • Compact 16x16 mm FBGA package suitable for space-constrained designs

Microcontrollers Applications

  • USB audio interfaces and sound cards
  • Digital signal processing in communication systems
  • Real-time control applications requiring precise timing
  • Portable audio devices and recording equipment

Microcontrollers Procurement Notes

Verify the complete part number including the package type (FB217), core count (A10), memory size (128), and temperature grade (C10). Ensure compatibility with existing PCB footprints for the 217-pin FBGA configuration. Confirm that the commercial temperature rating meets the operational environment requirements of the target application before finalizing procurement.

Microcontrollers Selection Notes

Select this model when eight processing cores are required for parallel task handling. The 128 KB SRAM capacity supports moderate data buffering needs. Consider the FBGA package constraints for board layout. Compare against other XCore variants if higher core counts or different memory sizes are necessary for specific performance thresholds.

Microcontrollers Part Context

This component belongs to the XMOS XS1 series, which utilizes the XCore architecture designed for multi-core parallel processing. The XS1 line targets applications demanding high determinism and low latency. The A10 designation indicates an 8-core variant within this generation, balancing computational power with package density for embedded solutions.

Microcontrollers Replacement Considerations

XS1-A10A-128-FB217-C8

Microcontrollers FAQ

What is the memory configuration of the XS1-A10A-128-FB217-C10?

It contains 128 KB of SRAM organized as 32K x 32 bits.

How many processing cores does this microcontroller have?

The device features eight parallel processing cores.

XS1-A10A-128-FB217-C10XS1-A10A-128-FB217-C10

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