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XTR104AU is listed in the Sensor And Detector Interfaces range at ChipApex. The manufacturer field lists Burr Brown. Its product description is INSTRUMENTATION AMPLIFIER. Review the specifications below when checking this part for your BOM.
The XTR104AU is a monolithic integrated circuit designed as a precision 4-20mA current transmitter. It integrates bridge excitation, linearization, and signal conditioning capabilities for industrial sensor applications. The device operates within an ambient temperature range of -40°C to +85°C and utilizes a plastic small outline package (SOIC) with 16 pins. Key electrical specifications include a supply voltage range of 10.5V to 36V, a maximum output current of 22mA, and a typical linearity error of 0.01%. It features adjustable gain and offset to accommodate various bridge sensor configurations.
Verify the specific suffix AU indicates the commercial temperature grade and SOIC-16 package configuration before ordering. Confirm that the supplier provides original manufacturer documentation or authorized distributor certificates to ensure component authenticity. Check for any recent lifecycle notices regarding obsolescence or recommended replacements for long-term production stability.
Select this component when a single-chip solution for bridge sensor signal conditioning is required. Ensure the application demands a 4-20mA output standard and operates within the specified voltage and temperature limits. Compare against the XTR104AP if a ceramic package is needed for higher thermal performance or military-grade environments.
The XTR104AU belongs to the Burr-Brown XTR10x family of current transmitters, which are widely used in industrial automation. This series consolidates multiple discrete components into a single IC, reducing board space and improving reliability. The AU variant specifically denotes the plastic surface-mount package suitable for automated assembly processes.
The XTR104AP serves as a pin-compatible alternative offering a ceramic package for enhanced thermal dissipation. Verify functional equivalence regarding pinout and electrical parameters before substituting. Consult official datasheets to confirm compatibility with existing PCB layouts and thermal management strategies.
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