XVF3000-TQ128-CA

XVF3000-TQ128-CA

  • Description:IC MCU FLASH MEM 65NM 128TQFP
  • Series:xCORE VocalFusion™

SKU:b105dd1715f5 Category: Brand:

ChipApex WhatsApp

Consult the customer manager about the wholesale price.

consultation hotline:86-132-6715-2157

email:[email protected]
Contact the product manager for consultation. One-stop consultation is available.


Do you want a lower wholesale price? Please send us your inquiry and we will reply immediately.

Submitting!
Submission successful!
Submission failed!
Email error!
Phone number error!

Product Detailed Parameters

  • Description:IC MCU FLASH MEM 65NM 128TQFP
  • Series:xCORE VocalFusion™
  • Mfr:XMOS
  • Package:Tray
  • Type:Audio Processor
  • Interface:I2C, I2S, USB
  • Clock Rate:16kHz, 48kHz
  • Non-Volatile Memory:-
  • On-Chip RAM:-
  • Voltage - I/O:-
  • Voltage - Core:-
  • Operating Temperature:-
  • Mounting Type:Surface Mount
  • Package / Case:128-TQFP Exposed Pad
  • Supplier Device Package:128-TQFP (14x14)

Download product information

XVF3000-TQ128-CA

Overview

The XVF3000-TQ128-CA is a voice interface controller from XMOS, designed for smart speaker and far-field microphone array applications. It integrates an xCORE processor with dedicated hardware accelerators for beamforming, noise suppression, and echo cancellation. The component operates within a voltage range of 0.95V to 3.6V and supports surface-mount installation in a 128-pin TQFP package. It enables high-quality audio capture in noisy environments by processing inputs from multiple microphones to isolate user speech.

Feature Summary

  • Integrated xCORE architecture with specialized DSP blocks for acoustic echo cancellation (AEC) and noise suppression
  • Supports multi-microphone array configurations for robust far-field voice pickup
  • Operates on a single supply voltage between 0.95V and 3.6V
  • Available in a 128-lead Thin Quad Flat Pack (TQFP) surface-mount package

Applications

  • Smart speakers and voice-controlled home assistants
  • Conference phones and video conferencing systems
  • Automotive infotainment voice interfaces
  • IoT devices requiring hands-free voice interaction

Procurement Notes

Verify the specific suffix 'CA' against the manufacturer's current datasheet to confirm pinout compatibility and revision status. Ensure that the design accounts for the required external crystal oscillator and decoupling capacitors as specified in the reference schematic. Confirm RoHS compliance documentation is available for the specific batch.

Selection Notes

Select this model when a complete voice front-end solution is required, eliminating the need for separate DSP chips for AEC and beamforming. Compare pin counts and I/O availability against the target microphone array size. Consider the thermal performance of the TQFP package if the device will operate continuously in enclosed spaces.

Part Context

This part belongs to the XMOS XVF series, which focuses on voice interface solutions. It differs from the XL series by including integrated acoustic processing algorithms and hardware accelerators tailored for microphone arrays, whereas the XL series provides general-purpose parallel processing cores without dedicated audio DSP blocks.

Replacement Considerations

Direct pin-to-pin replacements are not publicly documented for this specific variant. Alternative XMOS parts may require significant schematic and firmware redesign due to differences in core architecture and peripheral availability.

XVF3000-TQ128-CAXVF3000-TQ128-CA

Click on the inquiry