XYFBBCNANF-20.000000

Crystals Overview

The Taitien XYFBBCNANF-20.000000 is a surface-mount crystal component operating at a fundamental frequency of 20 MHz. It utilizes a 4-SMD, No Lead package with dimensions of 3.20mm x 2.50mm x 1.00mm maximum height. The device features a load capacitance of 16 pF and an equivalent series resistance (ESR) of 80 Ohms. Frequency stability is rated at ±10 ppm across the standard commercial temperature range.

Crystals Feature Summary

• Compact 3.2x2.5mm SMD footprint for space-constrained designs
• Standard 16pF load capacitance compatibility
• Lead-free RoHS compliant construction

Crystals Applications

• General purpose digital clock generation
• Microcontroller system timing references
• Consumer electronic circuit boards

Crystals Procurement Notes

Verify the specific revision status and manufacturing date code upon receipt to ensure compliance with current environmental directives. Confirm that the receiving facility's soldering profile aligns with the thermal specifications outlined in the official datasheet to prevent mechanical stress or performance degradation during assembly processes.

Crystals Selection Notes

Select this component when a low-cost, general-purpose timing source is required for non-critical applications. The ±10 ppm stability is suitable for standard UART or SPI interfaces but may be insufficient for high-precision wireless protocols requiring tighter tolerance. Ensure the PCB layout accounts for the 16pF load capacitance requirement to maintain accurate frequency output.

Crystals Part Context

This part belongs to Taitien's standard SMD crystal lineup, designed for mass-market electronics. It serves as a basic timing reference alternative to larger through-hole packages. The 3225 package size balances board space efficiency with robust handling capabilities during automated pick-and-place manufacturing operations.

Crystals Replacement Considerations

Direct substitutes must match the 20 MHz frequency, 16pF load capacitance, 80 Ohm ESR, and 3.2x2.5mm package dimensions. Verify pinout compatibility and thermal characteristics before integration.