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XYHEECNANF-30.000000 is listed in the Crystals range at ChipApex. The manufacturer field lists Taitien. Its product description is CRYSTAL 30.0000MHZ 20PF SMD. Review the specifications below when checking this part for your BOM.
The XYHEECNANF-30.000000 is a fundamental mode MHz crystal manufactured by Taitien, designed for surface-mount applications. It operates at a nominal frequency of 30.000000 MHz with a load capacitance of 20 pF and an equivalent series resistance of 80 Ohms. The component meets AEC-Q200 automotive standards, ensuring reliability in demanding environments. It features a frequency stability and tolerance of ±30 ppm. The device is housed in a compact 4-SMD, no-lead package measuring 2.55mm x 2.05mm with a maximum height of 0.60mm. It supports a wide operating temperature range from -20°C to +70°C.
Verify the specific ordering suffix against the manufacturer's official datasheet to ensure correct packaging and specifications. Confirm that the AEC-Q200 qualification status aligns with your project's automotive requirements. Check for any recent product change notices or lifecycle updates directly from Taitien before finalizing procurement plans.
Select this component when a 30 MHz fundamental crystal with AEC-Q200 certification is required. Ensure the circuit design accommodates a 20 pF load capacitance and 80 Ohm ESR. Consider the 4-SMD package dimensions for layout constraints and verify that the ±30 ppm stability meets the system's timing accuracy needs within the specified temperature range.
This part belongs to Taitien's XY series of surface-mount crystals. The series provides various frequencies and packages for general electronic applications. The XYHEECNANF variant specifically targets automotive-grade reliability while maintaining standard SMD form factors for easy integration into modern manufacturing lines.
Consult Taitien's official substitution guide for direct replacements. Verify that any alternative maintains AEC-Q200 compliance, identical 20 pF load capacitance, and compatible package dimensions to ensure functional equivalence without redesign.
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