YFF15SC1H470MT000N

Overview

The TDK YFF15SC1H470MT000N is a surface-mount three-terminal EMI feedthrough filter capacitor designed for signal line applications. It features a capacitance of 47 pF with a ±20% tolerance and a rated voltage of 50 V DC. The component operates within a temperature range of -55°C to +125°C and supports a maximum current of 1 A. Its physical dimensions are 1.0 mm in length, 0.55 mm in width, and 0.3 mm in height, conforming to the 0402 (1005 Metric) package. The device exhibits a maximum DC resistance of 300 mOhms and provides insertion loss of 30 dB between 2 GHz and 6 GHz.

Feature Summary

• Three-terminal feedthrough architecture for effective high-frequency noise suppression
• Compact 0402 surface-mount footprint suitable for space-constrained designs
• Low DC resistance to minimize signal attenuation on data lines

Applications

• High-speed digital signal line filtering
• USB interface noise suppression
• HDMI port EMI mitigation
• General-purpose RF interference reduction in compact electronics

Procurement Notes

Verify the complete part number including suffixes against official TDK documentation to ensure correct dielectric type and tolerance. Confirm RoHS compliance status and moisture sensitivity level requirements prior to procurement. Cross-reference manufacturer datasheets for specific handling and reflow soldering profiles to maintain component integrity during assembly processes.

Selection Notes

Select this component when low parasitic inductance is critical for high-frequency performance. The three-terminal design offers superior grounding compared to standard two-terminal capacitors. Ensure the operating voltage remains below the 50 V rating and that the signal current does not exceed 1 A. Verify PCB pad layout compatibility with the specified 0402 dimensions for optimal thermal and electrical performance.

Part Context

This component belongs to the TDK YFF-SC series of surface-mount feedthrough filters. These devices utilize a coaxial structure to provide effective common-mode noise suppression while maintaining signal integrity. The series is engineered for modern electronic applications requiring compact form factors and reliable EMI/RFI mitigation in high-density circuit board layouts.

Replacement Considerations

Consult official TDK substitution guides for verified equivalents. Generic replacements may differ in parasitic inductance or frequency response characteristics.