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The TDK YFF21AC1E223MT0Y0N is an automotive-grade EMI feedthrough filter capacitor in the YFF-AC series. It features a capacitance of 22 nF with a ±20% tolerance and a rated voltage of 25 V DC. The component utilizes C0G dielectric material for stable performance across a temperature range of -55°C to +125°C. Housed in a compact 0805 (2.0 mm x 1.25 mm) surface-mount package with a height of 0.85 mm, it offers a maximum DC resistance of 300 mΩ. Certified under AEC-Q200 standards, this three-terminal device is designed for high-reliability applications requiring effective noise suppression in constrained spaces.
Verify the complete part number including suffixes to ensure correct capacitance, voltage rating, and termination specifications. Confirm AEC-Q200 certification status if automotive compliance is mandatory. Check datasheet revisions for any updates to mechanical dimensions or recommended soldering profiles. Ensure storage conditions align with moisture sensitivity level requirements prior to assembly.
Select this component when high-frequency noise suppression is critical in space-constrained automotive designs. The 22 nF value suits general-purpose decoupling and filtering tasks. Consider the 25 V rating against peak line voltages. The three-terminal design requires specific PCB layout techniques to maximize grounding effectiveness and minimize parasitic inductance.
This component belongs to TDK's YFF-AC series of automotive feedthrough capacitors. These devices are engineered specifically for the stringent reliability and environmental standards required in modern vehicles. The series offers various capacitance values within the same 0805 form factor, allowing designers to customize filtering characteristics without altering board layouts.
Direct substitutes must match the 0805 package, 22 nF capacitance, 25 V rating, and AEC-Q200 qualification. Verify that alternative components maintain similar low ESL characteristics and thermal stability ranges. Cross-reference pin configurations to ensure compatibility with existing footprints.