SEARCH
— IC芯片 | 连接器 | 传感器 | 被动器件 —
The TDK YFF21PC1E104MT009N is a three-terminal feed-through capacitor designed for high-frequency noise suppression. It features a capacitance of 0.1 µF with a tolerance of ±20% and a rated voltage of 25 V DC. The component utilizes a 0805 (2012 metric) surface-mount package, measuring approximately 2.0 mm x 1.25 mm x 0.85 mm. It supports a maximum DC current of 2 A and exhibits low equivalent series inductance (ESL), making it suitable for decoupling applications in compact electronic designs.
Verify the complete part number including the trailing suffix to ensure correct packaging and tape specifications. Confirm RoHS compliance status and lead-free requirements against specific project standards. Cross-reference the manufacturer datasheet for precise mechanical dimensions and soldering profile recommendations to prevent thermal damage during assembly processes.
Select this component when low ESL is critical for maintaining signal integrity at high frequencies. Ensure the 25 V rating exceeds the maximum operating voltage with adequate margin. Verify that the 2 A current handling capability meets the circuit's peak load requirements. Consider the 0805 package size relative to available PCB real estate and adjacent component spacing constraints.
This component belongs to TDK's YFF series of feed-through capacitors, which are engineered for effective electromagnetic interference suppression. The series utilizes a unique internal electrode structure to minimize parasitic inductance. These devices serve as alternatives to traditional ferrite beads or standard MLCCs in applications requiring superior high-frequency attenuation characteristics within a small form factor.
Direct substitutes include other TDK YFF series parts with matching 0.1 µF capacitance and 25 V rating, such as YFF21PC1A104M variants if voltage derating is acceptable. External manufacturers offering 0805 three-terminal feed-through capacitors with comparable ESL and current ratings may be considered after verifying electrical parameter alignment and mechanical fit.