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YFGC225WWA is listed in the Antennas RF range at ChipApex. The manufacturer field lists Quectel. Its product description is INT,GPS&GNSS,CERAMIC,-,NA,1559-1. Review the specifications below when checking this part for your BOM.
The Quectel YFGC225WWA is a passive ceramic patch GNSS antenna designed for embedded applications. It supports multiple global navigation satellite systems including GPS, GLONASS, Galileo, BeiDou, QZSS, and IRNSS across L1 and L5 frequency bands. The component measures 25 x 25 x 4 mm with an additional 18 x 18 x 4 mm section. It utilizes adhesive and soldering mount methods. The unit complies with RoHS and REACH standards.
Verify the specific orderable part number against official distributor catalogs to ensure correct suffix alignment. Confirm that the adhesive backing specification matches your assembly process requirements. Check for updated compliance certificates such as RoHS and REACH status before finalizing procurement. Ensure the selected variant matches the required L1/L5 band support for your target region.
Choose this component when multi-constellation support is critical for signal availability in urban environments. The ceramic patch design offers stability compared to plastic alternatives. Consider the physical dimensions of 25x25mm when planning PCB real estate. Verify that the host device provides adequate shielding to prevent interference with the sensitive L1 and L5 reception bands.
This model belongs to Quectel's embedded antenna portfolio focused on GNSS applications. It complements other RF solutions by providing dedicated positioning capabilities. The product line emphasizes compact form factors for integration into modern electronic devices. It serves as a specialized component within broader wireless communication ecosystems.
No public confirmed substitute part numbers are available in the provided documentation. Evaluate generic ceramic patch antennas only if they match the exact 25x25mm footprint and L1/L5 frequency specifications. Ensure any alternative maintains compatibility with adhesive and soldering mounting methods.
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