SEARCH
— IC芯片 | 连接器 | 传感器 | 被动器件 —
The Z00607MA1BA2 is a bidirectional thyristor manufactured by STMicroelectronics, designed for AC switching applications. It features an average on-state current (Irms) rating of 0.8 A and supports a repetitive peak reverse voltage of 600 V. The device is housed in a TO-92 through-hole package with three pins. Key electrical parameters include a maximum gate trigger current (Igt) of 7 mA, a maximum gate trigger voltage (Vgt) of 1.3 V, and a holding current (Ih) of 5 mA. It withstands a surge current of 9.5 A and operates within a temperature range of -40°C to +110°C.
Verify the complete part number including suffixes such as '1BA2' or '5BL2' against official STMicroelectronics documentation to ensure correct packaging and tape-and-reel specifications. Confirm that the specific variant matches the required pin configuration and marking code for your assembly process. Always cross-reference the latest datasheet for any updates to mechanical dimensions or electrical ratings before finalizing procurement orders.
Select this component when designing low-power AC control circuits requiring a compact through-hole solution. Ensure the load current does not exceed the 0.8 A RMS rating under all operating conditions. Verify that the gate drive circuit can supply at least 7 mA to guarantee reliable triggering. Consider the TO-92 package constraints regarding heat dissipation if the device will operate near its maximum temperature limit.
This thyristor belongs to STMicroelectronics' general-purpose triac family, optimized for consumer electronics and industrial control panels. The Z006 series typically offers high reliability and robustness against voltage transients. It serves as a cost-effective alternative to larger packages for applications where space is limited but through-hole mounting is preferred for mechanical stability.
Consult official substitution guides for equivalent triacs with matching 0.8 A current and 600 V voltage ratings. Verify compatibility of gate trigger characteristics and package dimensions before replacing the original component.