Z0805C252DSMST

Overview

The KEMET Z0805C252DSMST is a multilayer ferrite chip bead designed for surface-mount technology in the 0805 (2012 metric) package. It provides an impedance of 2500 ohms at the specified test frequency with a maximum DC current rating of 1 ampere. The component features a maximum DC resistance of 35 milliohms and operates within a temperature range from -55°C to +125°C. This device serves as a passive electronic component for high-frequency noise suppression.

Feature Summary

• Multilayer construction for compact surface-mount integration
• High impedance characteristics for effective electromagnetic interference filtering
• Robust thermal stability across extended industrial temperature ranges

Applications

• High-speed digital signal line noise suppression
• Power supply output filtering for integrated circuits
• Electromagnetic compatibility enhancement in communication modules

Procurement Notes

Verify the specific manufacturer datasheet for final electrical tolerances and mechanical dimensions before implementation. Confirm RoHS compliance status and end-of-life notifications directly with KEMET or authorized distributors, as availability may vary by region and production cycle.

Selection Notes

Select this component when high attenuation is required at specific high frequencies within a limited board space. Ensure the operating current remains below the rated maximum to prevent saturation. Verify that the low DC resistance meets the voltage drop requirements of the target circuit design.

Part Context

This ferrite bead belongs to the Z-SMS series from KEMET, which focuses on providing reliable noise suppression solutions for modern electronics. The 0805 form factor allows for automated assembly processes, making it suitable for mass production environments requiring consistent performance in compact designs.

Replacement Considerations

Consult official KEMET documentation for verified substitute part numbers. Cross-referencing requires matching impedance values, current ratings, and physical dimensions to ensure functional equivalence without redesigning the footprint.