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The Hoffman Enclosures Z3636A17FIP is a specialized industrial enclosure designed for precision electromagnetic interference (EMI) shielding applications. It utilizes FIP technology to provide a conductive housing capable of absorbing or reflecting electromagnetic waves, ensuring compliance with EMI regulations. The unit features a metallized plastic construction that offers design flexibility, reduced weight, and aesthetic advantages over traditional metal enclosures while maintaining high shielding performance through a uniform and continuous conductive surface.
Verify the specific model designation Z3636A17FIP against official Hoffman Enclosures documentation to confirm FIP technology integration. Ensure the metallized plastic material properties meet your required shielding effectiveness standards. Confirm dimensional accuracy for PCB component isolation needs. Validate that the conductive surface continuity meets your application's sealing requirements.
Select this model when standard metal enclosures are too heavy or costly for high-volume production. Consider this option if design flexibility and appearance are prioritized alongside shielding performance. Evaluate the need for precise component isolation on PCBs. Ensure the application environment does not compromise the integrity of the conductive mating faces or seams.
This component belongs to Hoffman Enclosures' range of shielded solutions. It addresses the challenge of providing high-level shielding in high-volume scenarios where metallized plastics offer distinct advantages over pure metal housings. The focus is on balancing regulatory compliance with practical manufacturing benefits like weight reduction and cost efficiency.
Public confirmed substitute part numbers are not available in the provided source data. Verify compatibility with existing mounting configurations if considering alternative shielded enclosures.