Z3636A17FIP

Z3636A17FIP

$355.41
  • Description:COVER GASKET FOR A-..H..GQRLP
  • Series:*
  • Mfr:Hoffman Enclosures, Inc.
  • Package:Bulk

SKU:90cd3e95d77a Category: Brand:

  
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Product Detailed Parameters

  • Description:COVER GASKET FOR A-..H..GQRLP
  • Series:*
  • Mfr:Hoffman Enclosures, Inc.
  • Package:Bulk

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Z3636A17FIP

Overview

The Hoffman Enclosures Z3636A17FIP is a specialized industrial enclosure designed for precision electromagnetic interference (EMI) shielding applications. It utilizes FIP technology to provide a conductive housing capable of absorbing or reflecting electromagnetic waves, ensuring compliance with EMI regulations. The unit features a metallized plastic construction that offers design flexibility, reduced weight, and aesthetic advantages over traditional metal enclosures while maintaining high shielding performance through a uniform and continuous conductive surface.

Feature Summary

  • Provides precision EMI shielding capabilities for electronic circuits
  • Utilizes FIP technology for effective absorption and reflection of electromagnetic waves
  • Constructed from metallized plastic to ensure design flexibility and reduced weight
  • Maintains a uniform and continuous conductive surface to prevent shielding loss at seams

Applications

  • Enclosing electronic circuits requiring strict EMI regulation compliance
  • Isolating individual components on printed circuit boards (PCBs)
  • High-volume applications where weight and cost are critical factors
  • Industrial environments needing robust electromagnetic protection

Procurement Notes

Verify the specific model designation Z3636A17FIP against official Hoffman Enclosures documentation to confirm FIP technology integration. Ensure the metallized plastic material properties meet your required shielding effectiveness standards. Confirm dimensional accuracy for PCB component isolation needs. Validate that the conductive surface continuity meets your application's sealing requirements.

Selection Notes

Select this model when standard metal enclosures are too heavy or costly for high-volume production. Consider this option if design flexibility and appearance are prioritized alongside shielding performance. Evaluate the need for precise component isolation on PCBs. Ensure the application environment does not compromise the integrity of the conductive mating faces or seams.

Part Context

This component belongs to Hoffman Enclosures' range of shielded solutions. It addresses the challenge of providing high-level shielding in high-volume scenarios where metallized plastics offer distinct advantages over pure metal housings. The focus is on balancing regulatory compliance with practical manufacturing benefits like weight reduction and cost efficiency.

Replacement Considerations

Public confirmed substitute part numbers are not available in the provided source data. Verify compatibility with existing mounting configurations if considering alternative shielded enclosures.

Z3636A17FIPZ3636A17FIP
$355.41
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