SEARCH
— IC芯片 | 连接器 | 传感器 | 被动器件 —
The Z4GP210-HF is a single-phase bridge rectifier manufactured by Comchip Technology, designed for surface-mount applications. It features an ABS(Z4) package and supports a peak reverse voltage of 1 kV with an average rectified current of 2 A. The device exhibits a forward voltage drop of 950 mV at 2 A and a maximum reverse leakage current of 5 µA at 1000 V. Operating temperatures range from -55°C to 175°C junction temperature. This component belongs to the Z4GP2xxL series, characterized as low-Vf, low-profile flat chip bridge rectifiers compliant with RoHS3 standards.
Verify the specific suffix 'HF' against official datasheets to confirm halogen-free status and compliance with current environmental regulations such as RoHS3. Ensure the ordering part number matches the exact electrical ratings required for the target application, particularly the 1 kV reverse voltage and 2 A current limits. Cross-reference manufacturer documentation for any recent product change notices affecting packaging or material composition.
Select this component when a surface-mount bridge rectifier with high voltage tolerance and low profile is required. Compare the 950 mV forward voltage drop against alternative packages to ensure thermal management meets system requirements. Verify that the ABS(Z4) footprint aligns with existing PCB layout constraints and that the 175°C junction temperature rating suits the operational environment.
This part belongs to the Z4GP2xxL series from Comchip Technology, which includes variants with different reverse voltage ratings such as the Z4GP206L-HF (600 V) and Z4GP208L-HF (800 V). All members share the same 2 A current rating, ABS(Z4) surface-mount package, and low-Vf characteristics. The series is designed to provide standardized mounting solutions across various voltage requirements.
Direct substitutes within the same series include Z4GP206L-HF and Z4GP208L-HF if lower voltage ratings are acceptable. Other manufacturers offering similar 2 A, 1 kV SMD bridge rectifiers in ABS or comparable packages should be evaluated based on pinout compatibility and thermal performance specifications.