ZDT749TC

Overview

The ZDT749TC is a dual PNP medium power transistor array manufactured by Diodes Incorporated. It integrates two independent PNP transistors within an SM-8 (SOT-223) surface-mount package. The device supports a continuous collector current of -2A per die and withstands a collector-emitter voltage of -25V. Key electrical specifications include a transition frequency of 100 to 160 MHz, a maximum total power dissipation of 2.75W when both dies are active, and a collector-base breakdown voltage of -35V. The component operates across a temperature range of -55°C to +150°C.

Feature Summary

• Dual configuration integrating two independent PNP transistors in a single compact surface-mount package
• Medium power handling capability with a continuous collector current rating of -2A per die
• High thermal stability supporting operation up to +150°C junction temperature
• Fast switching performance characterized by a transition frequency up to 160 MHz

Applications

• General-purpose switching circuits requiring dual PNP configurations
• Power management modules utilizing medium current loads
• Driver stages for relay or solenoid control applications

Procurement Notes

Verify the specific ordering suffix against the manufacturer's official documentation to confirm package type and tape-and-reel specifications. Confirm RoHS compliance status and environmental declarations prior to procurement. Ensure the source document matches the exact part number to avoid discrepancies in pinout or electrical ratings.

Selection Notes

Select this component for designs requiring dual PNP arrays in a space-constrained surface-mount footprint. Evaluate the thermal resistance values relative to the PCB copper area to ensure adequate heat dissipation. Verify that the required collector current and voltage levels remain within the absolute maximum ratings under all operating conditions.

Part Context

This component belongs to the ZDT series of dual transistor arrays produced by Diodes Incorporated. The 'TC' suffix typically denotes a specific packaging variant, such as tape and reel, intended for automated assembly processes. The device utilizes the SM-8 lead frame structure, providing a robust mechanical solution for high-density board layouts.

Replacement Considerations

Consult the manufacturer's official substitution guide for verified equivalent parts. Ensure any replacement maintains identical pinout compatibility and meets or exceeds the original voltage and current ratings.