ZL30169LDF1

Overview

The ZL30169LDF1 is a clock translator integrated circuit manufactured by Microchip Technology, designed for telecommunications applications. It features a single circuit with a maximum frequency of 1.035GHz and supports differential input and output signals. The device accepts CML, CMOS, or crystal inputs and provides CML or CMOS outputs. It operates within a temperature range of -40°C to 85°C and is housed in a 32-QFN package. The component includes an internal PLL and maintains a 4:3 input-to-output ratio.

Feature Summary

• Supports high-frequency operation up to 1.035GHz
• Features differential input and output capabilities
• Compatible with CML, CMOS, and crystal input sources
• Housed in a compact 32-QFN surface-mount package

Applications

• Telecommunications systems requiring precise clock translation
• Network synchronization equipment
• High-speed digital signal processing interfaces

Procurement Notes

Verify the specific suffix LDF1 corresponds to the tape-and-reel packaging configuration when ordering. Confirm that the 32-QFN footprint matches the target PCB design. Ensure compliance with RoHS3 standards as indicated in the environmental classification data provided by the manufacturer.

Selection Notes

Select this component when a 4:3 frequency ratio is required for telecom clocking. Verify that the input signal format (CML/CMOS/Crystal) aligns with the system source. Ensure the 1.035GHz maximum frequency meets the application requirements without exceeding the specified operating temperature range of -40°C to 85°C.

Part Context

This part belongs to the ZL30169 family of clock translators from Microchip Technology. It is distinct from other ZL301xx series devices like the ZL30110 or ZL30240 by its specific 4:3 ratio and 1.035GHz capability. The LDF1 suffix denotes the specific packaging and reel configuration for automated assembly.

Replacement Considerations

Direct substitutes must match the 32-QFN package and 4:3 ratio. Evaluate ZL30169 variants with different suffixes only if packaging differences are acceptable. Cross-reference electrical parameters such as max frequency and input/output types before considering alternative models.