ZL30312GKG2

Overview

The ZL30312GKG2 is a timing-over-packet integrated circuit manufactured by Microchip Technology, formerly Microsemi. It is designed for precise clock distribution over packet-switched networks, supporting Ethernet and Stratum standards. The device features an internal Phase-Locked Loop (PLL) to synchronize output clocks with input references. It operates within a temperature range of -40°C to 85°C and is housed in a 256-BGA package measuring 17x17 mm. The maximum operating frequency reaches 125 MHz, making it suitable for applications requiring high-precision timing synchronization in telecommunications infrastructure.

Feature Summary

• Supports Timing-over-Packet protocols for network-based clock distribution
• Complies with Ethernet and Stratum timing standards
• Integrated PLL for low-jitter clock generation
• Surface-mount 256-BGA (17x17 mm) packaging

Applications

• Telecommunications base stations requiring precise synchronization
• Network infrastructure equipment needing Stratum-level timing
• Ethernet-based timing distribution systems

Procurement Notes

Verify the specific suffix 'GKG2' against official Microchip documentation to confirm pinout, voltage, and thermal specifications. Ensure compatibility with existing board layouts due to the 256-BGA package dimensions. Confirm RoHS compliance status through current datasheets before procurement.

Selection Notes

Select this component when precise timing synchronization over packet networks is required. Ensure the design supports the 125 MHz maximum frequency and operates within the -40°C to 85°C industrial temperature range. Verify that the host system can accommodate the 256-BGA footprint and associated thermal management requirements.

Part Context

This part belongs to the ZL3031x family of timing-over-packet ICs from Microchip Technology. These devices are engineered for telecom applications where traditional hardware clocks are replaced or supplemented by network-synchronized timing signals. The GKG2 suffix denotes a specific package and temperature grade variant within this product line.

Replacement Considerations

Consult Microchip's official cross-reference tools for verified substitutes. Generic timing ICs may not support the specific Timing-over-Packet protocols or Stratum compliance required by this application.