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ZML-105-53-G-D-530-SM is listed in the Headers, Male Pins range at ChipApex. The manufacturer field lists Samtec Inc.. Its product description is .050" X .100" MICRO SHROUDED TER. Review the specifications below when checking this part for your BOM.
The ZML-105-53-G-D-530-SM is a board stacking connector manufactured by Samtec. It features 10 contacts arranged in two rows with a male contact gender and straight orientation. The connector utilizes a 0.05-inch pitch and surface mount terminals for PCB attachment. Key physical attributes include a black insulator, guide slots for alignment, and gold-plated contact finishes.
Verify the specific part number configuration against official Samtec documentation before procurement. Confirm that the required contact count, row arrangement, and termination style match the design specifications. Ensure compliance with relevant environmental standards such as RoHS if applicable to the target market. Cross-reference the datasheet for any specific handling or storage requirements associated with surface mount components.
Select this component when a low-profile board stacking solution with a 0.05-inch pitch is required. The straight orientation and surface mount terminals make it suitable for designs where vertical space is limited. Consider the guide slot feature if precise mating alignment is critical for the application. Verify that the contact finish and material properties meet the electrical performance needs of the system.
This component belongs to the ZML series of board stacking connectors from Samtec. The series is designed for high-density interconnect applications requiring reliable mechanical and electrical performance. The specific model indicates a 10-contact configuration with dual-row layout, catering to compact electronic assemblies needing robust stacking capabilities.
Consult official Samtec resources for verified substitute part numbers. Ensure any replacement maintains identical pitch, contact count, and mounting style. Verify compatibility with existing PCB footprints and mating connectors before substitution.
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