ZSC31014EID

ZSC31014EID

$2.80
  • Description:DICE (WAFER SAWN) - WAFFLE PACK
  • Series:*

SKU:56a76493bb2f Category: Brand:

  
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Product Detailed Parameters

  • Description:DICE (WAFER SAWN) - WAFFLE PACK
  • Series:*
  • Mfr:Renesas Electronics Corporation
  • Package:Tray
  • Type:-
  • Input Type:-
  • Output Type:-
  • Current - Supply:-
  • Operating Temperature:-
  • Mounting Type:-
  • Package / Case:-
  • Supplier Device Package:-
  • Grade:-
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ZSC31014EID

Overview

The ZSC31014EID is a RBiciLite digital output sensor signal conditioner manufactured by Renesas Electronics Corporation. It provides high-accuracy amplification and analog-to-digital conversion of differential input signals from resistive bridge sensors. The device performs offset, span, and first- and second-order temperature compensation using an internal digital signal processor. Calibration coefficients are stored in nonvolatile EEPROM. It features configurable I²C or SPI digital outputs for compensated bridge values and optional temperature data.

Feature Summary

  • RBiciLite CMOS integrated circuit providing high-accuracy amplification and analog-to-digital conversion
  • Internal digital signal processor for offset, span, and temperature drift compensation
  • Configurable I²C or SPI digital output interfaces
  • Integrated diagnostic functions and low-power standby mode

Applications

  • Resistive bridge sensor correction
  • Cost-sensitive sensor applications requiring digital mating
  • Systems needing simultaneous configuration and calibration of multiple ICs

Procurement Notes

Verify the specific suffix EID against official Renesas documentation to confirm it denotes the DICE (Wafer Sawn) package variant. Ensure compatibility with mass calibration systems if deploying multiple units. Confirm moisture sensitivity levels and handling requirements prior to assembly.

Selection Notes

Select this component when digital compensation of signal offset, sensitivity, and non-linearity is required without external trimming. It is suitable for applications utilizing resistive bridge sensors where I²C or SPI connectivity is preferred over analog outputs. Evaluate the need for internal versus external temperature sensing based on system architecture.

Part Context

The ZSC31014 series includes variants such as ZSC31014EIC and ZSC31014EIG1. The EID suffix typically indicates a dice or wafer-sawn configuration, distinct from packaged versions like SOIC-8. This family is designed for sensor signal conditioning with integrated digital processing capabilities.

Replacement Considerations

Publicly confirmed substitute part numbers for the ZSC31014EID are not available in the provided reference material. Cross-comparison with other ZSC31014 variants requires verification of package and electrical parameter alignment.

ZSC31014EIDZSC31014EID
$2.80
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