ZSC31050FEC

Description：DICE (WAFER SAWN) - FRAME
Series：*

SKU:7461bcc7829d Category: Sensor and Detector Interfaces Brand: Renesas Electronics Corporation

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Product introduction

Product Detailed Parameters

Description：DICE (WAFER SAWN) - FRAME
Series：*
Mfr：Renesas Electronics Corporation
Package：Tray
Type：-
Input Type：-
Output Type：-
Current - Supply：-
Operating Temperature：-
Mounting Type：-
Package / Case：-
Supplier Device Package：-
Grade：-
Qualification：-

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ZSC31050FEC

Overview

The ZSC31050FEC is a sensor signal conditioner manufactured by Renesas Electronics, belonging to the ZSC31050 series. It is classified as a sensor interface component designed for advanced differential sensor applications. The device is supplied in a die package format, specifically described as wafer sawn within a frame, and utilizes SMD/SMT installation methods. It operates within a supply voltage range of 2.7 V to 5.5 V and supports an operating temperature range from -40°C to +150°C. The unit weighs approximately 130 mg and is housed in an SSOP-16 compatible footprint configuration despite being a bare die.

Feature Summary

Advanced differential sensor signal conditioning capabilities
High-temperature operational stability up to 150°C
Flexible power supply compatibility between 2.7V and 5.5V

Applications

Automotive sensor systems requiring high thermal tolerance
Industrial pressure or acceleration sensing interfaces
Harsh environment signal conditioning modules

Procurement Notes

Verify the specific die handling requirements and frame packaging specifications before procurement. Confirm that the design infrastructure supports direct die attachment processes. Ensure compliance with moisture sensitivity levels if applicable. Check for updated RoHS documentation status. Validate electrical parameters against the latest official datasheet revision.

Selection Notes

Select this component when a bare die solution is required for space-constrained or high-volume manufacturing. Compare against packaged variants like ZSC31050FEG1-R if assembly flexibility is needed. Consider the SSOP-16 pinout mapping for PCB layout design. Evaluate thermal management strategies suitable for die-level integration.

Part Context

This part belongs to the ZSC31050 family of sensor interfaces. It shares functional characteristics with packaged versions such as ZSC31050FEG1-T and ZSC31050DAG1-T. The primary distinction lies in the physical form factor, offering a die configuration instead of a standard plastic package. This allows for custom substrate integration.

How to buy

Online and offline orders are supported. If the item is available for online purchase, you can place it in the cart; for wholesale pricing, please contact our product manager for a quote.

Payment Method

Payment methods: T/T, WeChat Pay, credit cards, Google Pay, Apple Pay . Buyer covers shipping, fees, duties, and taxes; contact our product manager if you need a contract/procurement process.

Delivery time

In-stock items usually ship within 24 hours. Otherwise, shipment is arranged 1 to 2 days after the items arrive at our warehouse. Timing depends on destination and shipping method.

Freight calculation

Freight cost depends on destination, package size, and weight . We offer shipping options via DHL, FedEx, UPS, and TNT , and can ship using your freight account upon request.

Mode of Transportation

We ship via DHL, FedEx, UPS, and TNT. If you prefer a specific logistics provider, we can ship using your designated carrier.

Return and Refund

Returns are accepted within 60 days of invoice with RMA approval. Items must be resalable; original invoice and test report are required. No returns for customer errors.