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Product Detailed Parameters
- Description：DICE (WAFER SAWN) - WAFFLE PACK
- Series：*
- Mfr：Renesas Electronics Corporation
- Package：Tray
- Type：-
- Input Type：-
- Output Type：-
- Current - Supply：-
- Operating Temperature：-
- Mounting Type：-
- Package / Case：-
- Supplier Device Package：-
- Grade：-
- Qualification：-
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Overview
The ZSC31150GED is a sensor signal conditioner from Renesas Electronics, designed for amplification and correction of bridge sensor signals. It features an I2C interface and operates on a supply voltage ranging from 4.5 V to 5.5 V. The device draws a typical operating current of 5.5 mA and provides an analog output with a maximum current of 5 mA. It includes ESD protection and is qualified under AEC-Q100 standards. The component is housed in a Die package format.
Feature Summary
- Digital compensation for sensor offset, sensitivity, temperature drift, and non-linearity
- Accommodates resistive bridge sensors via programmable gain amplifier and ADC
- Supports safety applications through integrated diagnostic functions
Applications
- Automotive pressure sensors
- Force and torque sensing systems
- Steering and braking system diagnostics
Procurement Notes
Verify the specific die revision and wafer lot details when sourcing bare die components. Confirm that the handling equipment supports the required electrostatic discharge precautions. Ensure the application design accounts for the thermal characteristics associated with the exposed die configuration during operation.
Selection Notes
Select this part when a bare die solution is required for space-constrained automotive designs. Compare against the ZSC31150GEG1-T if a packaged SSOP-14 form factor is preferred instead of direct board mounting. Verify compatibility with the target PCB substrate for die attachment processes.
Part Context
This component belongs to the ZSC31150 series of sensor interfaces. It shares core functionality with other variants like the ZSC31150GAB but differs in physical packaging. The series targets high-reliability environments requiring precise signal conditioning for piezoresistive elements.
Replacement Considerations
The ZSC31150GEG1-T offers identical electrical performance in a standard SSOP-14 package. The ZSC31150GAB serves as an alternative wafer-level option. Direct pin-to-pin replacement is not applicable due to the die form factor.
