ZSSC3018BA1C

ZSSC3018BA1C

$1.62
  • Description:DICE (WAFER SAWN) - FRAME
  • Series:-

SKU:dbe1728b401c Category: Brand:

  
  • Quantity
    • -
    • +
  •    
ChipApex WhatsApp

Consult the customer manager about the wholesale price.

consultation hotline:86-132-6715-2157

email:[email protected]
Contact the product manager for consultation. One-stop consultation is available.


Do you want a lower wholesale price? Please send us your inquiry and we will reply immediately.

Submitting!
Submission successful!
Submission failed!
Email error!
Phone number error!

Product Detailed Parameters

  • Description:DICE (WAFER SAWN) - FRAME
  • Series:-
  • Mfr:Renesas Electronics Corporation
  • Package:Tray
  • Type:Signal Conditioner
  • Input Type:Differential
  • Output Type:I2C, Serial, SPI
  • Current - Supply:1.5 mA
  • Operating Temperature:-40°C ~ 125°C (TA)
  • Mounting Type:Surface Mount
  • Package / Case:Die
  • Supplier Device Package:Die
  • Grade:-
  • Qualification:-

Download product information

ZSSC3018BA1C

Overview

The ZSSC3018BA1C is a high-resolution sensor signal conditioner integrated circuit designed for precision amplification and analog-to-digital conversion of differential or pseudo-differential input signals. It features an 18-bit analog-to-digital converter (ADC) and a fully programmable gain amplifier with a linear gain range from 6.6 to 216. The device incorporates an internal auto-compensated temperature sensor and utilizes a 26-bit digital signal processor to perform digital compensation of individual sensor offset, gain, and first and second-order temperature drifts. Digital outputs are configurable as I²C operating at frequencies up to 3.4MHz or SPI operating at frequencies up to 10MHz.

Feature Summary

  • Flexible, programmable analog front-end design supporting high-accuracy signal conditioning
  • Internal digital signal processor enables comprehensive offset, span, and temperature compensation algorithms
  • On-chip non-volatile memory stores calibration coefficients for persistent configuration

Applications

  • High-resolution sensor module applications requiring precise measurement
  • Correction of resistive bridge sensors
  • Correction of absolute voltage sensors
  • Temperature measurement systems utilizing internal sensor data

Procurement Notes

Verify the specific suffix BA1C against official Renesas documentation to confirm package type and tape-and-reel specifications. Confirm RoHS compliance status and lead-free markings on the component marking. Ensure the source document explicitly lists this exact part number variant rather than the general family designation.

Selection Notes

Select this component when application requirements demand 18-bit resolution and programmable gain amplification for differential inputs. Verify that the required communication interface matches either I²C or SPI capabilities. Ensure the system can accommodate the necessary calibration procedure using the serial interface to program the internal MTP memory before deployment.

Part Context

This component belongs to the ZSSC30xx series of sensor signal conditioners developed by Renesas Electronics. The series focuses on integrating analog front-end processing with digital compensation capabilities to enhance sensor accuracy and noise immunity in industrial and automotive environments.

Replacement Considerations

Consult official Renesas documentation for confirmed substitute part numbers within the ZSSC30xx family. Verify pin compatibility and functional equivalence before considering any alternative components.

ZSSC3018BA1CZSSC3018BA1C
$1.62
Buy Now