ZSSC3027AC6B

ZSSC3027AC6B

$1.06
  • Description:WAFER (UNSAWN) - BOX
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SKU:117158039611 Category: Brand:

  
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Product Detailed Parameters

  • Description:WAFER (UNSAWN) - BOX
  • Series:*
  • Mfr:Renesas Electronics Corporation
  • Package:Tray
  • Type:-
  • Input Type:-
  • Output Type:-
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ZSSC3027AC6B

Overview

The ZSSC3027AC6B is a sensor signal conditioner integrated circuit manufactured by Renesas Electronics. It features a flexible, programmable analog front-end with a scalable 16-bit charge-balancing two-segment analog-to-digital converter (ADC). The device includes a fully programmable gain amplifier accepting sensors from 14 to 72 linear factor and an internal auto-compensated temperature sensor. Digital compensation for individual sensor offset, gain, and temperature drift is handled by an 18-bit internal digital signal processor. Calibration coefficients are stored in non-volatile multiple-time programmable memory. The component is supplied as a wafer sawn die.

Feature Summary

  • Flexible, programmable analog front-end design with scalable 16-bit resolution
  • Internal auto-compensated temperature sensor for calibration support
  • Digital compensation of sensor offset, gain, and temperature drift via 18-bit DSP
  • Layout customized for die-die bonding with sensor for high-density chip-on-board assembly

Applications

  • High-accuracy altimeter module applications
  • Resistive bridge sensor correction systems
  • Wireless pressure sensor modules

Procurement Notes

Verify the specific ordering suffix AC6B against the manufacturer's official datasheet to confirm package type and material specifications. Ensure compatibility with existing calibration algorithms and serial interface configurations before integration. Confirm availability status directly with authorized distributors as supply levels fluctuate.

Selection Notes

Select this component when high-resolution amplification and analog-to-digital conversion of differential input signals are required. It is suitable for designs needing precise offset, span, and temperature compensation without external complex circuitry. Consider the die form factor for custom packaging solutions requiring direct sensor mating.

Part Context

This part belongs to the ZSSC3027 series of sensor signal conditioners. It shares functional similarities with the ZSSC3026 but may offer updated performance characteristics or specific interface configurations. The series is designed for correcting resistive bridge sensors and providing corrected digital outputs via I2C or SPI interfaces.

Replacement Considerations

The ZSSC3026CI1B is a related model within the same product family. Verify pinout compatibility and software calibration data portability before substitution. Differences in factory packaging or specific electrical tolerances should be reviewed in the respective datasheets.

ZSSC3027AC6BZSSC3027AC6B
$1.06
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