ZSSC3123AA8B

ZSSC3123AA8B

$1.56
  • Description:OPN - WAFER (UNSAWN) - BOX
  • Series:cLite™

SKU:b4c6b5940bae Category: Brand:

  
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Product Detailed Parameters

  • Description:OPN - WAFER (UNSAWN) - BOX
  • Series:cLite™
  • Mfr:Renesas Electronics Corporation
  • Package:Tray
  • Type:Capacitive Sensor
  • Input Type:Capacitive
  • Output Type:I2C, SPI
  • Current - Supply:1.1 mA
  • Operating Temperature:-40°C ~ 125°C (TA)
  • Mounting Type:Surface Mount
  • Package / Case:Die
  • Supplier Device Package:Die
  • Grade:-
  • Qualification:-

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ZSSC3123AA8B

Overview

The ZSSC3123AA8B is a capacitive sensor signal conditioner with digital output manufactured by Renesas Electronics. It provides 14-bit resolution and ±0.25% accuracy over a wide range of sensor capacitances and temperatures. The device operates on a supply voltage between 2.3 V and 5.5 V, consuming 100 µA during operation. It supports I2C, serial, and SPI interfaces. The component is available as an unsawn wafer die in a gel pack box, designed for chip-on-board assembly.

Feature Summary

  • Digital compensation for sensor offset, sensitivity, and temperature drift using internal algorithms
  • Configurable for single or differential capacitive sensors up to 10pF input capacitance
  • Built-in sleep mode reducing current consumption below 1 µA at temperatures up to 85°C
  • Internal temperature compensation reference eliminating the need for external components

Applications

  • Capacitive pressure sensors
  • Capacitive level sensing
  • Force and weight measurement systems

Procurement Notes

Verify the specific suffix AA8B indicates the unsawn wafer die configuration in a gel pack box. Confirm compatibility with your PCB assembly process for die-bonding. Check the latest datasheet for any updates on calibration coefficients or EEPROM programming requirements before finalizing procurement specifications.

Selection Notes

Select this part when high accuracy (±0.25%) and low power consumption are critical for capacitive sensing applications. Ensure the application requires a die-level component for cost-effective chip-on-board integration. Verify that the system can accommodate the required sampling rates and digital interface protocols supported by the ZSSC3123 family.

Part Context

The ZSSC3123AA8B belongs to the ZSSC312x series of capacitive sensor signal conditioners. It is pin-to-pin compatible with other variants in the family, such as the ZSSC3122, allowing for flexible design choices based on packaging needs. The series is designed for accurate capacitance-to-digital conversion with integrated sensor-specific correction capabilities.

Replacement Considerations

The ZSSC3122 is noted as pin-to-pin compatible. Verify if alternative package options like ZSSC3123AA7R (TSSOP) meet mechanical constraints. Consult Renesas for any direct replacements within the PLP program if long-term availability is a concern.

ZSSC3123AA8BZSSC3123AA8B
$1.56
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