ZSSC3123AI1D

ZSSC3123AI1D

$4.62
  • Description:DICE (WAFER SAWN) - WAFFLE PACK
  • Series:*

SKU:f3389b11e55e Category: Brand:

  
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Product Detailed Parameters

  • Description:DICE (WAFER SAWN) - WAFFLE PACK
  • Series:*
  • Mfr:Renesas Electronics Corporation
  • Package:Tray
  • Type:-
  • Input Type:-
  • Output Type:-
  • Current - Supply:-
  • Operating Temperature:-
  • Mounting Type:-
  • Package / Case:-
  • Supplier Device Package:-
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ZSSC3123AI1D

Overview

The ZSSC3123AI1D is a capacitive sensor signal conditioner manufactured by Renesas Electronics. It provides digital output for capacitive sensing applications with an operating voltage range of 2.3 V to 5.5 V and a maximum supply current of 100 uA. The device supports I2C, Serial, and SPI interfaces and features differential input for single-channel operation. Designed for surface mount installation, it is supplied in a Die package within a Gel Pack. The component operates reliably across a temperature range from -40°C to +125°C.

Feature Summary

  • CMOS integrated circuit designed for accurate capacitance-to-digital conversion
  • Built-in digital compensation for sensor offset, sensitivity, and temperature drift
  • Supports flexible communication via I2C, Serial, or SPI interfaces
  • Configurable for capacitive sensors up to 10pF with high accuracy

Applications

  • Capacitive touch sensing systems
  • Proximity detection modules
  • Level sensing applications
  • IoT environmental monitoring devices

Procurement Notes

Verify the specific suffix 'AI1D' against official Renesas documentation to confirm pinout and electrical characteristics, as variations exist within the ZSSC3123 family. Confirm availability status directly with authorized distributors, as inventory levels fluctuate. Ensure the Gel Pack die format aligns with your assembly capabilities for chip-on-board integration.

Selection Notes

Select this component when high accuracy over wide temperature ranges is required for capacitive sensors. Consider the die package format if space constraints favor direct bonding. Verify interface compatibility with the host microcontroller. Compare against the ZSSC3122 if different compensation algorithms or packaging options are needed.

Part Context

The ZSSC3123 belongs to Renesas' sensor signal conditioning portfolio, aimed at simplifying IoT design by integrating calibration and amplification. It complements Renesas MCUs by handling precise sensor data acquisition. The series supports rapid prototyping through dedicated development kits like the ZSSC3123KITV1.0.

Replacement Considerations

The ZSSC3122 is noted as pin-to-pin compatible with similar functionality. Verify specific electrical parameters and package availability before substitution. Other models in the ZSSC3123 series may offer different packaging or interface configurations.

ZSSC3123AI1DZSSC3123AI1D
$4.62
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