ZSSC3131BA1D

ZSSC3131BA1D

  • Description:DICE (WAFER SAWN) - WAFFLE PACK
  • Series:*

SKU:46fd69450c17 Category: Brand:

ChipApex WhatsApp

Consult the customer manager about the wholesale price.

consultation hotline:86-132-6715-2157

email:[email protected]
Contact the product manager for consultation. One-stop consultation is available.


Do you want a lower wholesale price? Please send us your inquiry and we will reply immediately.

Submitting!
Submission successful!
Submission failed!
Email error!
Phone number error!

Product Detailed Parameters

  • Description:DICE (WAFER SAWN) - WAFFLE PACK
  • Series:*
  • Mfr:Renesas Electronics Corporation
  • Package:Tray
  • Type:-
  • Input Type:-
  • Output Type:-
  • Current - Supply:-
  • Operating Temperature:-
  • Mounting Type:-
  • Package / Case:-
  • Supplier Device Package:-
  • Grade:-
  • Qualification:-

Download product information

ZSSC3131BA1D

Overview

The ZSSC3131BA1D is a CMOS integrated circuit within the ZSSC313x family, designed for automotive and industrial sensor applications. It provides high-accuracy amplification and sensor-specific correction of resistive bridge signals. Key parameters include a sample rate up to 200 Hz, ADC resolution of 13/14 bit, and supply current of max 5.5 mA. The device supports an operation temperature range from -40°C to +150°C and offers high voltage protection up to 33 V.

Feature Summary

  • Internal 16-bit RISC microcontroller executes correction algorithms to compensate for sensor offset, sensitivity, temperature drift, and non-linearity.
  • Integrated adjustable digital filter enables configuration for fast switching real-time applications or stabilized outputs under disturbed conditions.
  • Single-pass calibration procedure stores required coefficients in on-chip EEPROM for traceability via user-defined entries.

Applications

  • Automotive sensor signal conditioning
  • Industrial resistive bridge sensor interfaces
  • Cost-sensitive switch applications

Procurement Notes

Verify the specific suffix BA1D against official Renesas documentation to confirm pinout and package details. Ensure compatibility with existing calibration tools and EEPROM programming procedures before integration into production designs.

Selection Notes

Select this component when cost optimization and simple switch applications are prioritized over ultra-high resolution. It is suitable for environments requiring wide temperature operation and robust protection features without complex external compensation circuits.

Part Context

This part belongs to the ZSSC313x product family of sensor signal conditioners. It complements Renesas' broader portfolio by providing specialized analog front-end processing for piezoresistive and other resistive bridge sensors in IoT and embedded systems.

Replacement Considerations

Check for direct pin-compatible alternatives within the ZSSC313x family, such as the ZSSC3135, which targets piezoresistive sensors specifically. Verify functional equivalence regarding gain stages and interface protocols before substitution.

ZSSC3131BA1DZSSC3131BA1D

Click on the inquiry