ZSSC3138BE1D

ZSSC3138BE1D

$6.86
  • Description:DICE (WAFER SAWN) - WAFFLE PACK
  • Series:*

SKU:eba3b59e8a38 Category: Brand:

  
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Product Detailed Parameters

  • Description:DICE (WAFER SAWN) - WAFFLE PACK
  • Series:*
  • Mfr:Renesas Electronics Corporation
  • Package:Tray
  • Type:-
  • Input Type:-
  • Output Type:-
  • Current - Supply:-
  • Operating Temperature:-
  • Mounting Type:-
  • Package / Case:-
  • Supplier Device Package:-
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ZSSC3138BE1D

Overview

The ZSSC3138BE1D is a sensor interface integrated circuit from the ZSSC313x family, manufactured by Renesas Electronics. It is designed for automotive and industrial resistive bridge sensor applications. The device features an internal 16-bit RISC microcontroller that performs digital compensation for offset, sensitivity, temperature drift, and non-linearity. Calibration coefficients are stored in on-chip EEPROM via a single-pass procedure. It offers an analog gain of 420 and supports ratiometric analog voltage output or ZACwire digital interface. The component operates within a supply voltage range of 4.5 V to 5.5 V and functions across a wide temperature range.

Feature Summary

  • Internal 16-bit RISC microcontroller executes correction algorithms for sensor signal conditioning
  • Digital compensation capabilities for offset, sensitivity, temperature drift, and non-linearity
  • Single-pass calibration procedure stores coefficients in on-chip EEPROM
  • Supports both ratiometric analog voltage output and ZACwire digital one-wire interface

Applications

  • Automotive ceramic thick-film-based sensor applications
  • Industrial strain gauge signal conditioning
  • Cost-optimized switch applications requiring high accuracy

Procurement Notes

Verify the specific package configuration when ordering, as the BE1D suffix indicates dice (wafer sawn) format typically supplied in waffle packs. Confirm availability with authorized distributors, as stock levels may be limited. Ensure compatibility with ECAD tools if simulation models are required for design integration. Check for any specific handling requirements associated with bare die components during assembly.

Selection Notes

Select the ZSSC3138BE1D when designing systems requiring precise amplification and correction of resistive bridge sensors without laser trimming. It is suitable for applications demanding high long-term stability and traceability through user-defined EEPROM entries. Consider this part for environments requiring operation up to +150°C and protection against reverse polarity and short circuits.

Part Context

This component belongs to the ZSSC313x product family of CMOS integrated circuits. Family members share common core functionalities for accurate amplification and sensor-specific correction. The ZSSC3138 variant specifically targets applications needing high amplification and offset compensation features compatible with ceramic thick-film elements and strain gauges.

Replacement Considerations

Consult official Renesas documentation for qualified substitute part numbers within the ZSSC313x family. Verify pinout and functional compatibility before replacing existing designs. No public confirmed substitute part numbers are listed in available sources.

ZSSC3138BE1DZSSC3138BE1D
$6.86
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