ZSSC3230BI5B

Overview

The ZSSC3230BI5B is a capacitive sensor signal conditioner IC from the Renesas ZSSC3230 series, manufactured by Renesas Electronics. It is supplied as an unawn wafer die in a gel pack package with factory packaging quantities of 21787 units. The component operates within a supply voltage range of 1.68 V to 3.6 V and features an I2C interface for digital output. Designed for low-power applications, it achieves average current consumption down to 1.3 µA at a 1 Hz conversion rate. The device integrates a high-precision capacitive analog front end and supports operation temperatures from -40°C to +125°C.

Feature Summary

• Integrates a high-precision capacitive analog front end for accurate sensing
• Optimized for battery-driven applications with ultra-low power consumption
• Provides digital output via I2C interface for system connectivity

Applications

• Battery-powered low-power sensing systems
• Capacitive sensor signal conditioning
• Data-driven sensing technologies requiring minimal energy usage

Procurement Notes

Verify the specific wafer configuration and ink marking requirements before procurement, as this part is supplied as an unsawn wafer die. Confirm that the manufacturing facility can handle bare die assembly processes compatible with the gel pack packaging format. Ensure compatibility with the required I2C bus speeds and voltage levels for the target application design.

Selection Notes

Select the ZSSC3230BI5B when a bare die solution is preferred over packaged ICs for space-constrained designs. Consider the ZSSC3230BI3W if a PQFN-24 packaged version with tape and reel delivery is required instead of wafer-level components. Evaluate the total system cost including die attachment and packaging versus pre-packaged alternatives.

Part Context

This component belongs to the ZSSC3230 family of sensor signal conditioners. Other variants include the ZSSC3230BC5B (unsawn wafer) and ZSSC3230BI3W (PQFN-24 package). The family shares core low-power capacitive sensing capabilities but differs in physical packaging and delivery formats to suit different manufacturing needs.

Replacement Considerations

The ZSSC3230BC5B serves as a direct alternative within the same series, offering identical functional specifications but potentially differing in wafer lot or ink marking details. For packaged replacements, the ZSSC3230BI3W provides the same electrical performance in a PQFN-24 footprint.