ZSSC3241DL1B

ZSSC3241DL1B

$1.78
  • Description:WAFER (UNSAWN) - WAFER BOX
  • Series:-

SKU:4f5f37eb3196 Category: Brand:

  
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Product Detailed Parameters

  • Description:WAFER (UNSAWN) - WAFER BOX
  • Series:-
  • Mfr:Renesas Electronics Corporation
  • Package:Tape & Reel (TR)
  • Type:Signal Conditioner
  • Input Type:Analog, Digital
  • Output Type:1-Wire®, I2C, SPI
  • Current - Supply:18 mA
  • Operating Temperature:-40°C ~ 125°C (TA)
  • Mounting Type:Surface Mount
  • Package / Case:Die
  • Supplier Device Package:Wafer
  • Grade:-
  • Qualification:-

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ZSSC3241DL1B

Overview

The ZSSC3241DL1B is a sensor signal conditioning integrated circuit manufactured by Renesas Electronics, supplied as an unsawn wafer in a gel pack. It provides high-precision amplification, digitization, and calibration for resistive sensors. The device features a 26-bit math core for digital compensation of offset, sensitivity, temperature drift, and non-linearity. It supports multiple communication interfaces including SPI, I2C, and OWI. The IC offers flexible output options such as absolute voltage, ratiometric voltage, and current loop signals. Designed for bridge and half-bridge sensors, it includes on-chip diagnostics and programmable scheduling to optimize energy consumption and system safety.

Feature Summary

  • Supports advanced digital compensation using a 26-bit math core with coefficients stored in reprogrammable non-volatile memory
  • Provides versatile analog and digital output configurations including absolute voltage, ratiometric voltage, and 4mA to 20mA current loops
  • Features comprehensive on-chip self-diagnostic capabilities covering sensor connection integrity and memory completeness

Applications

  • Calibrated continuous operation sensors with digital or analog outputs
  • Pressure, flow, and level sensing systems
  • Industrial process and factory automation equipment
  • Smart digital sensors for energy-efficient solutions

Procurement Notes

Verify the specific wafer configuration and handling requirements when sourcing the ZSSC3241DL1B unsawn wafer form factor. Confirm compatibility with downstream die-attach and packaging processes. Ensure that the gel pack storage conditions meet manufacturer specifications to prevent moisture damage. Cross-reference the exact suffix DL1B with official Renesas documentation to confirm pinout and electrical characteristics match the design intent before integration.

Selection Notes

Select the ZSSC3241DL1B when designing systems requiring highly accurate signal conditioning for resistive bridge sensors. This component is suitable for applications demanding dual-domain analog and digital outputs. Consider its programmable scheduler for balancing power consumption against update rates. Verify that the required interface protocols, such as SPI or I2C, align with the host controller capabilities. Evaluate the need for its specific diagnostic features for safety-critical industrial or medical environments.

Part Context

The ZSSC3241 series represents Renesas' sensor signal conditioning family optimized for automotive and industrial pressure sensing. The ZSSC3241DL1B specifically denotes the wafer-level variant of this IC. It shares architectural similarities with other members like the ZSSC3241DI3R but differs in physical delivery format. The series is designed to meet ISO26262 ASIL-B standards for functional safety in automotive applications.

Replacement Considerations

The ZSSC3241 is noted as being 99% backward compatible with the ZSSC3240. Designers migrating from the ZSSC3240 should verify EEPROM content and minor AFE configuration differences. No other direct substitute part numbers are confirmed in the provided data.

ZSSC3241DL1BZSSC3241DL1B
$1.78
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