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Product Detailed Parameters
- Description：DICE (WAFER SAWN) - WAFFLE PACK
- Series：-
- Mfr：Renesas Electronics Corporation
- Package：Tray
- Type：-
- Input Type：-
- Output Type：-
- Current - Supply：-
- Operating Temperature：-
- Mounting Type：-
- Package / Case：-
- Supplier Device Package：-
- Grade：-
- Qualification：-
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Overview
The ZSSC4165DE1D-ES is a sensor interface integrated circuit manufactured by Renesas Electronics Corporation. It is supplied in a DICE (Wafer Sawed) format within a Waffle Pack configuration. The component is categorized under Sensor Interface devices. This specific part number represents the bare die variant, intended for integration into custom packages or systems requiring direct wafer-level assembly rather than standard packaged ICs.
Feature Summary
- Sensor interface functionality
- Bare die construction
Applications
- Custom sensor module integration
- Wafer-level packaging applications
Procurement Notes
Verify availability status directly with authorized distributors as supply conditions may vary. Confirm that the DICE form factor aligns with your assembly capabilities, as this component requires specialized handling and packaging processes distinct from standard surface-mount devices. Ensure compatibility with your system's thermal and mechanical constraints for bare die attachment.
Selection Notes
Select this component only if your design supports direct die mounting and you require the specific sensor interface characteristics of the ZSSC4165 series. Consider the manufacturing implications of using waffle-packaged dice versus pre-packaged alternatives. Validate that your assembly line can handle the delicate nature of bare silicon components without damage.
Part Context
This part belongs to the ZSSC416x family of sensor interface products from Renesas. It shares functional similarities with other members like the ZSSC4175 series but differs in package type and specific interface configurations. The DE1D suffix typically denotes the specific die and packaging variant within this product line.
Replacement Considerations
Direct substitutes are limited due to the specific bare die configuration. Evaluate other ZSSC416x variants if packaged versions are acceptable. Consult Renesas for any updated die revisions or alternative bare die options that maintain pinout and electrical compatibility.
