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The ZTT-7.37MT is a ceramic resonator manufactured by ECS Inc., designed for through-hole mounting applications. It operates at a nominal frequency of 7.37 MHz with a built-in load capacitance of 30 pF. The component exhibits a frequency stability of ±0.2% and features an impedance of 25 Ohms. It supports a temperature range from -20°C to +80°C. Physical dimensions are specified as 10.00 mm in length, 5.00 mm in width, and 10.00 mm in height, utilizing a radial three-lead package with a 2.50 mm pitch.
Verify the specific ordering suffix against official ECS documentation to ensure correct tolerance and packaging specifications. Confirm that the required frequency stability and temperature range align with the target application's operational constraints before procurement. Cross-reference the lead configuration and physical dimensions with the PCB footprint requirements to guarantee mechanical compatibility during assembly.
Select this component when a cost-effective timing solution with integrated capacitance is required for through-hole assemblies. Consider the ±0.2% stability and 25 Ohm impedance characteristics for standard microcontroller interfaces. Evaluate the thermal performance within the -20°C to +80°C range to ensure reliability under expected operating conditions without requiring external compensation components.
The ZTT series represents a line of ceramic resonators from ECS Inc. characterized by wide frequency ranges and extended temperature capabilities. These components are engineered to replace quartz crystals in applications where moderate stability suffices. The ZTT-7.37MT specifically targets the 7.37 MHz frequency point within this family, offering a standardized solution for common communication and control protocols.
Direct substitutes include other ZTT series variants with compatible frequencies and pinouts. Verify equivalent electrical parameters such as impedance and capacitance when considering alternative manufacturers. Ensure any replacement maintains the same radial three-lead configuration and through-hole mounting style for direct board integration.